SLUS846D September   2008  – August 2024 UCC25600

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Soft Start
      2. 7.3.2 Overcurrent Protection
      3. 7.3.3 Gate Driver
      4. 7.3.4 Overtemperature Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Burst-Mode Operation
      2. 7.4.2 VCC
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Principal of Operation
      2. 8.1.2 Adjustable Dead Time
      3. 8.1.3 Oscillator
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Support Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
  13. 12Glossary
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MINMAXUNIT
Supply voltage, VCC22V
Voltage, GD1, GD2–0.5VCC + 0.5V
Gate drive current – continuous, GD1, GD2±25mA
Current, RT–5mA
Current, DT–0.7mA
Lead temperature (10 seconds)260°C
Operating junction temperature, TJ–40125°C
Storage temperature, Tstg–65150°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.