SLUSDX3C november 2020 – august 2023 UCC25800-Q1
PRODUCTION DATA
PIN | TYPE(1) | DESCRIPTION | |
---|---|---|---|
NAME | NO. | ||
DIS/FLT | 2 | I/O | UCC25800-Q1 disable pin (active low) and fault code output pin. |
GND | 6 | G | The GND pin is the return for all the control and power signals. The layout should separate the power and control signals. |
OC/DT | 4 | I | Voltage on this pin sets the maximum dead-time between the internal switching power devices. The Thevenin resistance on the pin is measured at start-up to set the OCP level. |
RT | 5 | – | Switching frequency setting pin. Connect a resistor from RT pin to GND to set the converter switching frequency. The RT pin can be left open to operate the converter at the default 1.2-MHz switching frequency. |
SW | 7 | – | The switch node of the integrated half-bridge. Connect this pin directly to the transformer. |
SYNC | 1 | I | External clock input for frequency synchronization. The internal MOSFETs are switched synchronized with the rising edge of the SYNC signal, with half of the SYNC pin signal frequency. |
VCC | 8 | I | The input for power and control of UCC25800-Q1. A good high-frequency by-pass capacitor between VCC and GND is needed to ensure high-efficiency, low-EMI design. Use the bypass capacitor layout to minimize the VCC-GND-bypass capacitor loop to reduce the stresses on internal power devices. Referring to Section 11 for layout guidelines. |
VREG | 3 | O | Internal regulated reference. Put a decoupling capacitor right across VREG pin and GND with shortest distance. The VREG pin can also be used as an external supply. |
Thermal Pad | – | Connect this pad to GND pin to provide thermal management for the device. Thermal vias are recommended if the design uses multilayer PCB. |