SLUS822C June   2008  – August 2016 UCC27200-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Stages
        1. 7.3.1.1 Undervoltage Lockout (UVLO)
        2. 7.3.1.2 Level Shift
        3. 7.3.1.3 Boot Diode
        4. 7.3.1.4 Output Stages
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Switching the MOSFETs
      2. 8.1.2 Dynamic Switching of the MOSFETs
      3. 8.1.3 Delay Matching and Narrow Pulse Widths
      4. 8.1.4 Boot-Diode Performance
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Threshold Type
        2. 8.2.2.2 VDD Bias Supply Voltage
        3. 8.2.2.3 Peak Source and Sink Currents
        4. 8.2.2.4 Propagation Delay
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Power Dissipation
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resource
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from B Revision (March 2016) to C Revision

  • Changed the device temperature grade in the Features section from Grade 0 (–40°C to 150°C) to Grade 1 (–40°C to 125°C) Go
  • Added the Receiving Notification of Documentation Updates sectionGo

Changes from A Revision (November 2008) to B Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Added AEC-Q100 Qualification bulletsGo
  • Changed device numbers UCC2720x and UCC27200 to UCC2720x-Q1 and UCC27200-Q1 Go
  • Deleted Wirebond Life figure Go
  • Moved references from Additional References section to Related Documentation sectionGo