SLUSCG0B December 2015 – July 2024 UCC27211A-Q1
PRODUCTION DATA
THERMAL METRIC(1) | UCC27211A-Q1 | UNIT | ||
---|---|---|---|---|
D (SOIC) | DDA (PowerPad™ SOIC) | |||
8 Pins | 8 Pins | |||
RθJA | Junction-to-ambient thermal resistance | 112.5 | 47.1 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 52.1 | 60.8 | °C/W |
RθJB | Junction-to-board thermal resistance | 59.6 | 21.3 | °C/W |
ψJT | Junction-to-top characterization parameter | 7 | 6.3 | °C/W |
ψJB | Junction-to-board characterization parameter | 58.7 | 21.3 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | - | 6.2 | °C/W |