SNVSAQ5B November   2018  – May 2022 UCC27282

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable
      2. 7.3.2 Start-up and UVLO
      3. 7.3.3 Input Stages and Interlock
      4. 7.3.4 Level Shifter
      5. 7.3.5 Output Stage
      6. 7.3.6 Negative Voltage Transients
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Select Bootstrap and VDD Capacitor
        2. 8.2.2.2 Estimate Driver Power Losses
        3. 8.2.2.3 Selecting External Gate Resistor
        4. 8.2.2.4 Delays and Pulse Width
        5. 8.2.2.5 External Bootstrap Diode
        6. 8.2.2.6 VDD and Input Filter
        7. 8.2.2.7 Transient Protection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) UCC27282 UNIT
D DRC DRM DPR
8 PINS 10 PINS 8 PINS 10 PINS
RθJA Junction-to-ambient thermal resistance 118.3 47.3 TBD TBD °C/W
RθJC(top) Junction-to-case (top) thermal resistance 53.6 50.3 TBD TBD °C/W
RθJB Junction-to-board thermal resistance 63.1 21.3 TBD TBD °C/W
ψJT Junction-to-top characterization parameter 10.7 1.0 TBD TBD °C/W
ψJB Junction-to-board characterization parameter 62.1 21.2 TBD TBD °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a 4.4 TBD TBD °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.