SNVSAQ5B November   2018  – May 2022 UCC27282

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable
      2. 7.3.2 Start-up and UVLO
      3. 7.3.3 Input Stages and Interlock
      4. 7.3.4 Level Shifter
      5. 7.3.5 Output Stage
      6. 7.3.6 Negative Voltage Transients
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Select Bootstrap and VDD Capacitor
        2. 8.2.2.2 Estimate Driver Power Losses
        3. 8.2.2.3 Selecting External Gate Resistor
        4. 8.2.2.4 Delays and Pulse Width
        5. 8.2.2.5 External Bootstrap Diode
        6. 8.2.2.6 VDD and Input Filter
        7. 8.2.2.7 Transient Protection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Switching Characteristics

VDD = VHB = 12 V, VHS = VSS = 0 V, No load on LO or HO, TJ = –40°C to +140°C, (unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
PROPAGATION DELAYS
tDLFFVLI falling to VLO fallingSee Section 6.71630ns
tDHFFVHI falling to VHO fallingSee Section 6.71630ns
tDLRRVLI rising to VLO risingSee Section 6.71630ns
tDHRRVHI rising to VHO risingSee Section 6.71630ns
DELAY MATCHING
tMONFrom LO being ON to HO being OFFSee Section 6.717ns
tMOFFFrom LO being OFF to HO being ONSee Section 6.717ns
OUTPUT RISE AND FALL TIME
tRLO, HO rise timeCLOAD = 1800 pF, 10% to 90%12ns
tFLO, HO fall timeCLOAD = 1800 pF, 90% to 10%10ns
tRLO, HO (3 V to 9 V) rise timeCLOAD = 0.1 μF, 30% to 70%0.330.6μs
tFLO, HO (3 V to 9 V) fall timeCLOAD = 0.1 μF, 70% to 30%0.230.6μs
MISCELLANEOUS
TPW,minMinimum input pulse width that changes the output20ns
Bootstrap diode turnoff time(1)IF = 20 mA, IREV = 0.5 A50ns
(1) Parameter not tested in production