SLUSDU4A December   2020  – May 2022 UCC27289

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable
      2. 7.3.2 Start-up and UVLO
      3. 7.3.3 Input Stages
      4. 7.3.4 Level Shifter
      5. 7.3.5 Output Stage
      6. 7.3.6 Negative Voltage Transients
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Select Bootstrap and VDD Capacitor
        2. 8.2.2.2 External Bootstrap Diode and Series Resistor
        3. 8.2.2.3 Estimate Driver Power Losses
        4. 8.2.2.4 Selecting External Gate Resistor
        5. 8.2.2.5 Delays and Pulse Width
        6. 8.2.2.6 VDD and Input Filter
        7. 8.2.2.7 Transient Protection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)UCC27289UNIT
DRCDRMDPRD
10 PINS8 PINS10 PINS8 PINS
RθJAJunction-to-ambient thermal resistance47.343.343.0118.3°C/W
RθJC(top)Junction-to-case (top) thermal resistance50.337.733.053.6°C/W
RθJBJunction-to-board thermal resistance21.319.219.063.1°C/W
ψJTJunction-to-top characterization parameter1.00.80.610.7°C/W
ψJBJunction-to-board characterization parameter21.219.219.062.1°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance4.46.36.2n/a°C/W
(1) For more information about thermal metrics see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.