SLUSA13E February   2010  – November 2023 UCC27321-Q1 , UCC27322-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Description (continued)
  6. Related Products
  7. Pin Configuration and Functions
  8. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Stage
      2. 8.3.2 Output Stage
      3. 8.3.3 Source and Sink Capabilities During Miller Plateau
      4. 8.3.4 VDD
      5. 8.3.5 Drive Current and Power Requirements
      6. 8.3.6 Enable
    4. 8.4 Device Functional Modes
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Input-to-Output Configuration
        2. 9.2.2.2 Input Threshold Type
        3. 9.2.2.3 VDD Bias Supply Voltage
        4. 9.2.2.4 Peak Source and Sink Currents
        5. 9.2.2.5 Enable and Disable Function
        6. 9.2.2.6 Propagation Delay
      3. 9.2.3 Application Curves
  11. 10Power Supply Recommendations
    1.     40
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
    4. 11.4 Power Dissipation
  13. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  14. 13Revision History
  15. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Overview

The UCC27321-Q1 and UCC27322-Q1 drivers serve as an interface between low-power controllers (discrete controllers, DSPs, MCUs, or microprocessors) and power MOSFETs. High-frequency power supplies often require high-speed, high-current drivers such as the UCC2732x-Q1 family. A leading application provides a high-power buffer stage between the PWM output of the control device and the gates of the primary power MOSFET or IGBT switching devices. In other cases, the device drives the power device gates through a drive transformer. Synchronous rectification supplies also have the need to drive multiple devices simultaneously, which can present an extremely large load to the control circuitry.

The inverting driver (UCC27321-Q1) is useful for generating inverted gate-drive signals from controllers that have outputs of the opposite polarity. For example, this driver can provide a gate signal for ground-referenced, N-channel synchronous rectifier MOSFETs in buck derived converters. This driver can also be used for generating a gate-drive signal for a P-channel MOSFET from a controller that is designed for N-channel applications.

MOSFET gate drivers are generally used when it is not feasible to have the primary PWM regulator device directly drive the switching devices for one or more reasons. The PWM device may not have the brute drive capability required for the intended switching MOSFET, limiting the switching performance in the application. In other cases, there may be a desire to minimize the effect of high-frequency switching noise by placing the high-current driver physically close to the load. Also, newer devices that target the highest operating frequencies may not incorporate onboard gate drivers at all. Their PWM outputs are only intended to drive the high-impedance input to a driver such as the UCC2732x-Q1. Finally, the control device may be under thermal stress due to power dissipation and an external driver can help by moving the heat from the controller to an external package.