SLUSA13E February 2010 – November 2023 UCC27321-Q1 , UCC27322-Q1
PRODUCTION DATA
In addition to 8-pin SOIC (D) package offerings, the UCC2732x-Q1 also comes in the thermally enhanced but tiny 8-pin MSOP-PowerPAD (DGN) package. The PowerPAD package drastically lowers the thermal resistance to extend the temperature operation range and improve long-term reliability.