SLUS545F November 2002 – November 2023 UCC27423 , UCC27424 , UCC27425
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
MIN | MAX | UNIT | |||
---|---|---|---|---|---|
VDD | Supply voltage | –0.3 | 16 | V | |
IOUT_DC | Output current (OUTA, OUTB) DC | 0.2 | A | ||
IOUT_PULSED | Pulsed, (0.5 μs) | 4.5 | A | ||
VIN | Input voltage (INA, INB) | –5 | 6 or VDD + 0.3 (whichever is larger) | V | |
Enable voltage (ENBA, ENBB) | –0.3 | 6 or VDD + 0.3 (whichever is larger) | V | ||
Power dissipation at TA = 25°C | DGN package | 3 | W | ||
D package | 650 | mW | |||
P package | 350 | ||||
TJ | Junction operating temperature | –55 | 150 | °C | |
Lead temperature (soldering, 10 s) | 300 | °C | |||
Tstg | Storage temperature | –65 | 150 | °C |