SLUSFC7 july   2023 UCC27444

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Supply Current
      2. 7.3.2 Input Stage
      3. 7.3.3 Enable Function
      4. 7.3.4 Output Stage
      5. 7.3.5 Low Propagation Delays and Tightly Matched Outputs
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 VDD and Power On Reset
        2. 8.2.2.2 Drive Current and Power Dissipation
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  12. 11Device and Documentation Support
    1. 11.1 Third-Party Products Disclaimer
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.4 Output Stage

The UCC27444 device output stage features a P-Channel architecture on the pullup structure, which delivers the highest peak source current when it is most needed, during the Miller plateau region of the power switch turn-on transition (when the power switch drain or collector voltage experiences dV/dt). This pull up achitecture closely emulates the behavior of the popular industry driver devices UCC2732x and UCC2742x. One characteristic of this pullup driver stage architecture is relatively consistent driver output rise and fall times over a wide VDD range.

GUID-20230707-SS0I-RDPG-BXG7-K1GHHDD6VFCX-low.svg Figure 7-1 UCC27444 Gate Driver Output Structure

The ROH parameter is a DC measurement and it is representative of the on-resistance of the P-Channel device on the pull-up stage of the device.

The pull-down structure in the UCC27444 device is simply comprised of a N-Channel MOSFET. The ROL parameter, which is also a DC measurement, is representative of the impedance of the pulldown stage in the device.

Each output stage in the UCC27444 device is capable of supplying 4-A peak source and 4-A peak sink current pulses. The output voltage swings between VDD and GND providing rail-to-rail operation, thanks to the MOS-output stage which delivers very low dropout. The presence of the MOSFET-body diodes also offers low impedance to transient overshoots and undershoots. The outputs of these drivers are designed to withstand 4 A of peak reverse current transients without damage to the device.

The UCC27444 device is particularly suited for dual-polarity, symmetrical drive-gate transformer applications where the primary winding of transformer driven by OUTA and OUTB, with inputs INA and INB being driven complementary to each other. This is possible because of the extremely low dropout offered by the MOS output stage of these devices, both during high (VOH) and low (VOL) states along with the low impedance of the driver output stage. All of these allow alleviate concerns regarding transformer demagnetization and flux imbalance. The low propagation delays also ensure proper reset for high-frequency applications.

For applications that have zero voltage switching during power MOSFET turn-on or turn-off interval, the driver supplies high-peak current for fast switching even though the miller plateau is not present. This situation often occurs in synchronous rectifier applications because the body diode is generally conducting before power MOSFET is switched on.