SLVSCO2B August   2014  – January 2024 UCC27511A-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Handling Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 VDD and Undervoltage Lockout
      2. 6.3.2 Operating Supply Current
      3. 6.3.3 Input Stage
      4. 6.3.4 Enable Function
      5. 6.3.5 Output Stage
      6. 6.3.6 Low Propagation Delays
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Input-to-Output Logic
        2. 7.2.2.2 Input Threshold Type
        3. 7.2.2.3 VDD Bias Supply Voltage
        4. 7.2.2.4 Peak Source and Sink Currents
        5. 7.2.2.5 Enable and Disable Function
        6. 7.2.2.6 Propagation Delay
        7. 7.2.2.7 Thermal Information
        8. 7.2.2.8 Power Dissipation
      3. 7.2.3 Application Curves
  9. 8 Power Supply Recommendations
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.2.1 Design Requirements

When selecting the proper gate driver device for an end application, some design considerations must be evaluated first in order to make the most appropriate selection. Among these considerations are input-to-output configuration, the input threshold type, bias supply voltage levels, peak source and sink currents, availability of independent enable and disable functions, propagation delay, power dissipation, and package type.