SLUSB33A May   2012  – December 2014 UCC27518 , UCC27519

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Switching Characteristics
    7. 8.7 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagrams
    3. 9.3 Feature Description
      1. 9.3.1 VDD and Undervoltage Lockout
      2. 9.3.2 Operating Supply Current
      3. 9.3.3 Input Stage
      4. 9.3.4 Enable Function
      5. 9.3.5 Output Stage
      6. 9.3.6 Low Propagation Delays
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Input-to-Output Logic
        2. 10.2.2.2 Input Threshold Type
        3. 10.2.2.3 VDD Bias Supply Voltage
        4. 10.2.2.4 Peak Source and Sink Currents
        5. 10.2.2.5 Enable and Disable Function
        6. 10.2.2.6 Propagation Delay
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Considerations
    4. 12.4 Power Dissipation
  13. 13Device and Documentation Support
    1. 13.1 Related Links
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8 Specifications

8.1 Absolute Maximum Ratings(1)(2)(3)

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Supply voltage VDD –0.3 20 V
OUT voltage –0.3 VDD + 0.3
Output continuous current IOUT_DC (source/sink) 0.3 A
Output pulsed current (0.5 µs) IOUT_pulsed(source/sink) 4
IN+, IN-(4), EN –0.3 20 V
Operating virtual junction temperature, TJ –40 150 °C
Lead temperature Soldering, 10 sec. 300
Reflow 260
Storage temperature, Tstg –65 150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to GND unless otherwise noted. Currents are positive into, negative out of the specified terminal. See Packaging Section of the data sheet for thermal limitations and considerations of packages.
(3) These devices are sensitive to electrostatic discharge; follow proper device handling procedures.
(4) Maximum voltage on input pins is not restricted by the voltage on the VDD pin.

8.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

8.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
Supply voltage range, VDD 4.5 12 18 V
Operating junction temperature range –40 140 °C
Input voltage, (IN+ and IN–) and Enable (EN) 0 18 V

8.4 Thermal Information

THERMAL METRIC UCC27518 UCC27519 UNIT
SOT-23 DBV SOT-23 DBV(1)
5 PINS 5 PINS
RθJA Junction-to-ambient thermal resistance(1) 217.6 217.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance(1) 85.8 85.8
RθJB Junction-to-board thermal resistance(1) 44.0 44.0
ψJT Junction-to-top characterization parameter(1) 4.0 4.0
ψJB Junction-to-board characterization parameter(1) 43.2 43.2
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

8.5 Electrical Characteristics

VDD = 12 V, TA = TJ = -40 °C to 140 °C, 1-µF capacitor from VDD to GND. Currents are positive into, negative out of the specified terminal.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
BIAS CURRENTS
IDD(off) Startup current VDD = 3.4 V IN+ = VDD (UCC27519),
IN- = GND (UCC27518)		 51 85 123 µA
IN+ = GND (UCC27519),
IN- = VDD (UCC27518)		 51 70 103
UNDERVOLTAGE LOCKOUT (UVLO)
VON Supply start threshold TA = 25 °C 3.85 4.20 4.57 V
TA = -40 °C to 140°C 3.80 4.20 4.67
VOFF Minimum operating voltage after supply start 3.45 3.9 4.35
VDD_H Supply voltage hysteresis 0.19 0.3 0.45
INPUTS (IN+, IN–)
VIN_H Input signal high threshold VDD = 4.5 V 55 62 %VDD
VIN_L Input signal low threshold 31 39
VIN_HYS Input signal hysteresis 16
VIN_H Input signal high threshold VDD = 12 V 55 59
VIN_L Input signal low threshold 31 39
VIN_HYS Input signal hysteresis 16
VIN_H Input signal high threshold VDD = 18 V 55 58
VIN_L Input signal low threshold 35 38
VIN_HYS Input signal hysteresis 17
ENABLE (EN)
VEN_H Enable signal high threshold VDD = 12 V 2.1 2.3 V
VEN_L Enable signal low threshold 1.00 1.25
VEN_HYS Enable hysteresis 0.86
SOURCE/SINK CURRENT
ISRC/SNK Source/sink peak current(1) CLOAD = 0.22 µF, FSW = 1 kHz -4/+4 A
OUTPUTS (OUT)
VDD-VOH High output voltage VDD = 12 V
IOUT = -10 mA		 50 90 mV
VDD = 4.5 V
IOUT = -10 mA		 60 130
VOL Low output voltage VDD = 12
IOUT = 10 mA		 5 11
VDD = 4.5 V
IOUT = 10 mA		 6 12
ROH Output pullup resistance(2) VDD = 12 V
IOUT = -10 mA		 5.0 7.5 Ω
VDD = 4.5 V
IOUT = -10 mA		 5.0 11.0
ROL Output pulldown resistance VDD = 12 V
IOUT = 10 mA		 0.5 1.0
VDD = 4.5 V
IOUT = 10 mA		 0.6 1.2
(1) Ensured by Design.
(2) ROH represents on-resistance of P-Channel MOSFET in pullup structure of the UCC27518 and UCC27519's output stage.

8.6 Switching Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tR Rise time(1) CLOAD = 1.8 nF 8 12 ns
tF Fall time(1) CLOAD = 1.8 nF 7 11
tD1 IN+ to output propagation delay(1) VDD = 10 V
7-V input pulse, CLOAD = 1.8 nF		 6 17 25
tD2 IN- to output propagation delay(1) VDD = 10 V
7-V input pulse, CLOAD = 1.8 nF		 6 17 24
tD3 EN to output high propagation delay(1) CLOAD = 1.8 nF, 5-V enable pulse 4 12 16
tD4 EN to output low propagation delay(1) CLOAD = 1.8 nF, 5-V enable pulse 4 12 19
(1) See timing diagrams in Figure 1, Figure 2, Figure 3, and Figure 4.
time1_lusb33.gif
(In+ Pin, UCC27519)
Figure 1. Noninverting Configuration
time2_lusb33.gif
(In– Pin, UCC27518)
Figure 2. Inverting Configuration
time3_lusb33.gif
(Noninverting Configuration, UCC27519)
Figure 3. Enable and Disable Function
time4_lusb33.gif
(Inverting Configuration, UCC27518)
Figure 4. Enable and Disable Function

8.7 Typical Characteristics

G001_Startup Current_lusaw9.png
Figure 5. Start-Up Current vs Temperature
G002_Operating Supply Current_lusaw9.png
Figure 7. Supply Current vs Temperature (Output In DC On/Off Condition)
G001_VIHL_vs_Temp_lusb33.png
Figure 9. Input Threshold vs Temperature
fig11_lusay4.png
Figure 11. Output Pulldown Resistance vs Temperature
G016_Fall Time_temp_lusaw9.png
Figure 13. Fall Time vs Temperature
G010_IDD_frequency_lusaw9.png
Figure 15. Operating Supply Current vs Frequency
G009_Fall Time_lusaw9.png
Figure 17. Fall Time vs Supply Voltage
G013_Idd_500kHz_lusaw9.png
Figure 6. Operating Supply Current vs Temperature (Output Switching)
G003_UVLO_lusaw9.png
Figure 8. UVLO Threshold Voltage vs Temperature
G004_Pull-Up Resistance_lusaw9.png
Figure 10. Output Pullup Resistance vs Temperature
G015_Rise Time_temp_lusaw9.png
Figure 12. Rise Time vs Temperature
G002_TDxx_vs_Temp_lusb33.png
Figure 14. Input To Output Propagation Delay vs Temperature
G008_Rise Time_lusaw9.png
Figure 16. Rise Time vs Supply Voltage