SLUSAQ3H November   2011  – June 2024 UCC27523 , UCC27525 , UCC27526

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Description (continued)
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 VDD and Undervoltage Lockout
      2. 7.3.2 Operating Supply Current
      3. 7.3.3 Input Stage
      4. 7.3.4 Enable Function
      5. 7.3.5 Output Stage
      6. 7.3.6 Low Propagation Delays and Tightly Matched Outputs
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input-to-Output Logic
        2. 8.2.2.2 Enable and Disable Function
        3. 8.2.2.3 VDD Bias Supply Voltage
        4. 8.2.2.4 Propagation Delay
        5. 8.2.2.5 Drive Current and Power Dissipation
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.1 Overview

The UCC2752x family of products represent TI’s latest generation of dual-channel, low-side, high-speed gate-driver devices featuring 5-A source and sink current capability, industry best-in-class switching characteristics and a host of other features listed in Table 7-1 all of which combine to ensure efficient, robust and reliable operation in high-frequency switching power circuits.

Table 7-1 UCC2752x Family of Features and Benefits
FEATUREBENEFIT
Best-in-class 13-ns (typ) propagation delayExtremely low-pulse transmission distortion
1-ns (typ) delay matching between channelsEase of paralleling outputs for higher (2 times) current capability, ease of driving parallel-power switches
Expanded VDD Operating range of 4.5 to 18 VFlexibility in system design
Expanded operating temperature range of –40°C to 140°C
(See Section 6.5)
VDD UVLO ProtectionOutputs are held Low in UVLO condition, which ensures predictable, glitch-free operation at power-up and power-down
Outputs held Low when input pins (INx) in floating conditionSafety feature, especially useful in passing abnormal condition tests during safety certification
Outputs enable when enable pins (ENx) in floating conditionPin-to-pin compatibility with UCC2732X family of products from TI, in designs where pin 1 and 8 are in floating condition
CMOS/TTL compatible input and enable threshold with wide hysteresisEnhanced noise immunity, while retaining compatibility with microcontroller logic level input signals (3.3 V, 5 V) optimized for digital power
Ability of input and enable pins to handle voltage levels not restricted by VDD pin bias voltageSystem simplification, especially related to auxiliary bias supply architecture