SLUSAQ3H November   2011  – June 2024 UCC27523 , UCC27525 , UCC27526

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Description (continued)
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 VDD and Undervoltage Lockout
      2. 7.3.2 Operating Supply Current
      3. 7.3.3 Input Stage
      4. 7.3.4 Enable Function
      5. 7.3.5 Output Stage
      6. 7.3.6 Low Propagation Delays and Tightly Matched Outputs
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input-to-Output Logic
        2. 8.2.2.2 Enable and Disable Function
        3. 8.2.2.3 VDD Bias Supply Voltage
        4. 8.2.2.4 Propagation Delay
        5. 8.2.2.5 Drive Current and Power Dissipation
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.3 Thermal Considerations

The useful range of a driver is greatly affected by the drive power requirements of the load and the thermal characteristics of the device package. In order for a gate-driver device to be useful over a particular temperature range the package must allow for the efficient removal of the heat produced while keeping the junction temperature within rated limits. The UCC27523/5/6 family of drivers is available in four different packages to cover a range of application requirements. The thermal metrics for each of these packages are summarized in Section 6.4. For detailed information regarding the thermal information table, refer to Application Note from Texas Instruments entitled, IC Package Thermal Metrics (SPRA953).

Among the different package options available in the UCC2752x family, of particular mention are the DSD and DGN packages when it comes to power dissipation capability. The MSOP PowerPAD-8 (DGN) package and 3-mm × 3-mm WSON (DSD) package offer a means of removing the heat from the semiconductor junction through the bottom of the package. Both these packages offer an exposed thermal pad at the base of the package. This pad is soldered to the copper on the printed-circuit-board directly underneath the device package, reducing the thermal resistance to a very low value. This allows a significant improvement in heat-sinking over that available in the D packages. The printed-circuit-board must be designed with thermal lands and thermal vias to complete the heat removal subsystem. Note that the exposed pads in the MSOP-8 (PowerPAD) and WSON-8 packages are not directly connected to any leads of the package, however, it is electrically and thermally connected to the substrate of the device which is the ground of the device. TI recommends to externally connect the exposed pads to GND in PCB layout for better EMI immunity.