SLUSBA5F December   2012  – March 2018 UCC27611

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 VDD and Undervoltage Lockout
      2. 7.3.2 Operating Supply Current
      3. 7.3.3 Input Stage
      4. 7.3.4 Enable Function
      5. 7.3.5 Output Stage
      6. 7.3.6 Low Propagation Delays
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Gate Drive Supply Voltage
        2. 8.2.2.2 Input Configuration
        3. 8.2.2.3 Output Configuration
        4. 8.2.2.4 Power Dissipation
        5. 8.2.2.5 Thermal Considerations
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

VDD = 12 V, TA = TJ = –40 °C to 140 °C, 2-µF capacitor from VDD to GND and from VREF to GND. Currents are positive into, negative out of the specified terminal. OUTH and OUTL are tied together. (unless otherwise noted) (1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
BIAS CURRENT
IDD(off) Start-up current VDD = 3, IN+ = VDD,
IN– = GND		 100 180 μA
IN+ = GND, IN– = VDD 75 160
UNDER VOLTAGE LOCKOUT (UVLO)
VDD(on) Supply start threshold 3.55 3.8 4.15 V
VDD(off) Minimum operating voltage after supply start 3.3 3.55 3.9 V
VDD_H Supply voltage hysteresis 0.25 V
INPUTS (IN+, IN–)
VIN_L Input signal low threshold Output high for IN– pin,
Output Low for IN+ pin		 0.9 1.1 1.3 V
VIN_H Input signal high threshold Output high for IN+ pin,
Output low for IN– pin		 1.85 2.05 2.25 V
VIN_HYS Input signal hysteresis 0.7 0.95 1.2 V
VREF
VREF VREF regulator output 4.75 5 5.15 V
VREF_line VREF line regulation VDD from 6 V to 18 V 0.05 V
VREF_load VREF load regulation IR from 0 mA to 50 mA 0.075 V
ISCC Short circuit current –90 –75 –60 mA
OUTPUTS (OUTH/OUTL AND OUT)
ISRC/SNK Source peak current (OUTH) / sink peak current (OUTL)(2) CLOAD = 0.22 µF, FSW = 1 kHz, (2) –4/+6 A
VOH OUTH high voltage IOUTH = –10 mA VDD –0.05 V
VOL OUTL low voltage IOUTL = 10 mA 0.02 V
ROH OUTH pullup resistance TA = 25 °C,
IOUT = –25 mA to –50 mA		 1 Ω
TA = –40 °C to 140 °C,
IOUT = –50 mA		 2
ROL OUTH pulldown resistance TA = 25 °C,
IOUT = 25 mA to 50 mA		 0.35 Ω
TA = –40°C to 140°C,
IOUT = 50 mA		 1.5
(1) Device operational with output switching.
(2) Ensured by design, not tested in production.