SLUSFL4A April   2024  – October 2024 UCC27614-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Timing Diagrams
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 VDD Undervoltage Lockout
      2. 6.3.2 Input Stage
      3. 6.3.3 Enable Function
      4. 6.3.4 Output Stage
    4. 6.4 Device Functional Modes
  8. 7  Applications and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Driving MOSFET/IGBT/SiC MOSFET
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Input-to-Output Configuration
          2. 7.2.1.2.2 Input Threshold Type
          3. 7.2.1.2.3 VDD Bias Supply Voltage
          4. 7.2.1.2.4 Peak Source and Sink Currents
          5. 7.2.1.2.5 Enable and Disable Function
          6. 7.2.1.2.6 Propagation Delay and Minimum Input Pulse Width
          7. 7.2.1.2.7 Power Dissipation
        3. 7.2.1.3 Application Curves
  9. 8 Power Supply Recommendations
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
    3. 9.3 Thermal Consideration
  11. 10Device and Documentation Support
    1. 10.1 Third-Party Products Disclaimer
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DSG|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.2.1.3 Application Curves

Many telecom and datacom isolated power modules employ synchronous rectification on the secondary side with center tap topology (as shown in UCC27614-Q1DSG Used to Drive Secondary Side Synchronous Rectifiers). The low-side driver UCC27614-Q1 can drive these synchronous rectifier MOSFETs as they are referenced to the output ground. These power modules are very power dense and the printed circuit board real estate is at a premium. These power modules may also have very high output current requirements and therefore either need very small Rds(on) MOSFETs or parallel multiple MOSFETs to achieve lower total Rds(on). In either case, the total get charge increases and therefore such applications need a gate driver with high drive current capability. UCC27614-Q1DSG fulfills all these requirements. The UCC27614-Q1DSG device is used in one such application of a 400-V to 12-V isolated DC-DC converter. Waveforms shown here are captured in this actual application power supply.

UCC27614-Q1 UCC27614-Q1DSG Used to Drive Secondary Side Synchronous Rectifiers Figure 7-2 UCC27614-Q1DSG Used to Drive Secondary Side Synchronous Rectifiers
UCC27614-Q1 UCC27614-Q1 Rising (Turn-On) Propagation DelayFigure 7-3 UCC27614-Q1 Rising (Turn-On) Propagation Delay
UCC27614-Q1 Synchronous Rectifier MOSFET VDS Rising Edge Using UCC27614-Q1DSGFigure 7-5 Synchronous Rectifier MOSFET VDS Rising Edge Using UCC27614-Q1DSG
UCC27614-Q1 Input and Output Voltage of Converter Using UCC27614-Q1DSGFigure 7-7 Input and Output Voltage of Converter Using UCC27614-Q1DSG
UCC27614-Q1 UCC27614-Q1 Falling (Turn-Off) Propagation DelayFigure 7-4 UCC27614-Q1 Falling (Turn-Off) Propagation Delay
UCC27614-Q1 Synchronous Rectifier MOSFET VDS Falling Edge Using UCC27614-Q1DSGFigure 7-6 Synchronous Rectifier MOSFET VDS Falling Edge Using UCC27614-Q1DSG
UCC27614-Q1 Output Voltage and Current of a Converter Using UCC27614-Q1DSGFigure 7-8 Output Voltage and Current of a Converter Using UCC27614-Q1DSG