SLUSFL4A April   2024  – October 2024 UCC27614-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Timing Diagrams
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 VDD Undervoltage Lockout
      2. 6.3.2 Input Stage
      3. 6.3.3 Enable Function
      4. 6.3.4 Output Stage
    4. 6.4 Device Functional Modes
  8. 7  Applications and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Driving MOSFET/IGBT/SiC MOSFET
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Input-to-Output Configuration
          2. 7.2.1.2.2 Input Threshold Type
          3. 7.2.1.2.3 VDD Bias Supply Voltage
          4. 7.2.1.2.4 Peak Source and Sink Currents
          5. 7.2.1.2.5 Enable and Disable Function
          6. 7.2.1.2.6 Propagation Delay and Minimum Input Pulse Width
          7. 7.2.1.2.7 Power Dissipation
        3. 7.2.1.3 Application Curves
  9. 8 Power Supply Recommendations
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
    3. 9.3 Thermal Consideration
  11. 10Device and Documentation Support
    1. 10.1 Third-Party Products Disclaimer
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DSG|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The UCC27614-Q1 is a single channel, high-speed, low-side gate driver capable of effectively driving MOSFET, IGBT, SiC, and GaN power switches. The UCC27614-Q1 has a typical peak drive strength of 10A, which reduces the rise and fall times of the power switches, lowering switching losses and increasing efficiency. The small propagation delay of the UCC27614-Q1 yields better power stage efficiency by improving dead-time optimization, pulse width utilization, control loop response, and transient performance of the system.

The UCC27614-Q1 can handle –10V on its inputs, which improves robustness in systems with moderate ground bouncing. The inputs are independent of supply voltage and can be connected to most controller outputs for maximum control flexibility. An independent enable signal allows the power stage to be controlled independent of the main control logic. The gate driver can quickly shut off the power stage if there is a fault in the system (which requires the power train to be turned off). The enable function also improves system robustness. Many high-frequency switching power supplies exhibit high frequency noise at the gate of the power device, which can get injected into the output pin of the gate driver and can cause the driver to malfunction. The UCC27614-Q1 performs well in such conditions due to its transient reverse current and reverse voltage capability.

The strong internal pulldown MOSFET holds the output low if the VDD voltage is below the specified UVLO threshold. This active pulldown feature further improves system robustness. The 10A drive current of the UCC27614-Q1 in the 2mm × 2mm package improves system power density. This small package also enables optimum gate driver placement and improved layout.

Package Information
PART NUMBER PACKAGE(1) PACKAGE SIZE(2) BODY SIZE (NOM)
UCC27614-Q1 DSG (SON 8) 2.0mm × 2.0mm 2.0mm x 2.0mm
UCC27614-Q1 D (SOIC 8) 4.9mm × 6mm 4.9mm × 3.9mm
UCC27614-Q1 DGN (VSSOP 8) 3.0mm × 4.9mm 3.0mm x 3.0mm
(1) For all available packages, see Section 12.
(2) The package size (length × width) is a nominal value and includes pins, where applicable.
UCC27614-Q1 Simplified Application Diagram Simplified Application Diagram