SLUSD05B October   2017  – August 2018 UCC27710

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
    1.     Typical Propagation Delay Comparison
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Dynamic Electrical Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 VDD and Under Voltage Lockout
      2. 8.3.2 Input and Output Logic Table
      3. 8.3.3 Input Stage
      4. 8.3.4 Output Stage
      5. 8.3.5 Level Shift
      6. 8.3.6 Low Propagation Delays and Tightly Matched Outputs
      7. 8.3.7 Parasitic Diode Structure
    4. 8.4 Device Functional Modes
      1. 8.4.1 Minimum Input Pulse Operation
      2. 8.4.2 Output Interlock and Dead Time
      3. 8.4.3 Operation Under 100% Duty Cycle Condition
      4. 8.4.4 Operation Under Negative HS Voltage Condition
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Selecting HI and LI Low Pass Filter Components (RHI, RLI, CHI, CLI)
        2. 9.2.2.2 Selecting Bootstrap Capacitor (CBOOT)
        3. 9.2.2.3 Selecting VDD Bypass/Holdup Capacitor (CVDD) and Rbias
        4. 9.2.2.4 Selecting Bootstrap Resistor (RBOOT)
        5. 9.2.2.5 Selecting Gate Resistor RON/ROFF
        6. 9.2.2.6 Selecting Bootstrap Diode
        7. 9.2.2.7 Estimate the UCC27710 Power Losses (PUCC27710)
        8. 9.2.2.8 Estimating Junction Temperature
        9. 9.2.2.9 Operation With IGBT's
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.7 Typical Characteristics

UCC27710 D001_slusdo5.gif
Figure 2. Low-Side, Turn-On Propagation Delay vs Temperature
UCC27710 D003_slusdo5.gif
Figure 4. High-Side, Turn-On Propagation Delay vs Temperature
UCC27710 D005_slusdo5.gif
Figure 6. Turn-On Delay Matching vs Temperature
UCC27710 D007_slusdo5.gif
Figure 8. High-Side Propagation Delay vs HS
UCC27710 D009_slusdo5.gif
Figure 10. LO Fall Time with 1000-pF Load vs Temperature
UCC27710 D0011_slusdo5.gif
Figure 12. HO Fall Time with 1000-pF Load vs Temperature
UCC27710 D0013_slusdo5.gif
Figure 14. VHB-VHS UVLO Thresholds vs Temperature
UCC27710 D0015_slusdo5.gif
Figure 16. HI/LI Pin High Threshold vs Temperature
UCC27710 D0017_slusdo5.gif
Figure 18. HI/LI Pin Hysteresis vs Temperature
UCC27710 D0019_slusdo5.gif
Figure 20. HO Output Pull-Down Resistance vs Temperature
UCC27710 D0021_slusdo5.gif
Figure 22. HO Output Pull-Up Resistance vs Temperature
UCC27710 D0023_slusdo5.gif
Figure 24. Quiescent HB to HS Supply Current vs Temperature
UCC27710 D0025_slusdo5.gif
Figure 26. VDD and HB Operating Current with No Load vs Switching Frequency
UCC27710 D0027_slusdo5.gif
Figure 28. VDD and HB Operating Current with 4700-pF Load vs Switching Frequency
UCC27710 D002_slusdo5.gif
Figure 3. Low-Side, Turn-Off Propagation Delay vs Temperature
UCC27710 D004_slusdo5.gif
Figure 5. High-Side, Turn-Off Propagation Delay vs Temperature
UCC27710 D006_slusdo5.gif
Figure 7. Turn-Off Delay Matching vs Temperature
UCC27710 D008_slusdo5.gif
Figure 9. LO Rise Time with 1000-pF Load vs Temperature
UCC27710 D0010_slusdo5.gif
Figure 11. HO Rise Time with 1000-pF Load vs Temperature
UCC27710 D0012_slusdo5.gif
Figure 13. VDD UVLO Thresholds vs Temperature
UCC27710 D0014_slusdo5.gif
Figure 15. VDD and VHB-VHS UVLO Hysteresis vs Temperature
UCC27710 D0016_slusdo5.gif
Figure 17. HI/LI Pin Low Threshold vs Temperature
UCC27710 D0018_slusdo5.gif
Figure 19. LO Output Pull-Down Resistance vs Temperature
UCC27710 D0020_slusdo5.gif
Figure 21. LO Output Pull-Up Resistance vs Temperature
UCC27710 D0022_slusdo5.gif
Figure 23. Total Quiescent VDD plus HB Supply Current vs Temperature
UCC27710 D0024_slusdo5.gif
Figure 25. HB to COM Bootstrap Supply Leakage Current vs Temperature
UCC27710 D0026_slusdo5.gif
Figure 27. VDD and HB Operating Current with 1000-pF Load vs Switching Frequency