SLUSDT2C August   2019  – December 2020 UCC28740-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1. 5.1 Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Detailed Pin Description
      2. 7.3.2 Valley-Switching and Valley-Skipping
      3. 7.3.3 Startup Operation
      4. 7.3.4 Fault Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Secondary-Side Optically Coupled Constant-Voltage (CV) Regulation
      2. 7.4.2 Primary-Side Constant-Current (CC) Regulation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 High Voltage Applications
    3. 8.3 Typical Application
      1. 8.3.1 Design Requirements
      2. 8.3.2 Detailed Design Procedure
        1. 8.3.2.1  Custom Design With WEBENCH® Tools
        2. 8.3.2.2  Standby Power Estimate and No-Load Switching Frequency
        3. 8.3.2.3  Input Bulk Capacitance and Minimum Bulk Voltage
        4. 8.3.2.4  35
        5. 8.3.2.5  Transformer Turns-Ratio, Inductance, Primary Peak Current
        6. 8.3.2.6  Transformer Parameter Verification
        7. 8.3.2.7  VS Resistor Divider, Line Compensation
        8. 8.3.2.8  Output Capacitance
        9. 8.3.2.9  VDD Capacitance, CVDD
        10. 8.3.2.10 Feedback Network Biasing
      3. 8.3.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 VDD Pin
      2. 10.1.2 VS Pin
      3. 10.1.3 FB Pin
      4. 10.1.4 GND Pin
      5. 10.1.5 CS Pin
      6. 10.1.6 DRV Pin
      7. 10.1.7 HV Pin
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Custom Design With WEBENCH® Tools
      2. 11.1.2 Device Nomenclature
        1. 11.1.2.1  Capacitance Terms in Farads
        2. 11.1.2.2  Duty Cycle Terms
        3. 11.1.2.3  Frequency Terms in Hertz
        4. 11.1.2.4  Current Terms in Amperes
        5. 11.1.2.5  Current and Voltage Scaling Terms
        6. 11.1.2.6  Transformer Terms
        7. 11.1.2.7  Power Terms in Watts
        8. 11.1.2.8  Resistance Terms in Ohms
        9. 11.1.2.9  Timing Terms in Seconds
        10. 11.1.2.10 Voltage Terms in Volts
        11. 11.1.2.11 AC Voltage Terms in VRMS
        12. 11.1.2.12 Efficiency Terms
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.2.8 Output Capacitance

The output capacitance value is often determined by the transient-response requirement from the no-load condition. For example, in typical low-power USB-charger applications, there is a requirement to maintain a minimum transient VO of 4.1 V with a load-step ITRAN from 0 mA to 500 mA. Yet new higher-performance applications require smaller transient voltage droop VOΔ with ITRAN of much greater amplitude (such as from no-load to full-load), which drives the need for high-speed opto-coupled voltage feedback.

Equation 27. GUID-09585EAE-18CE-408E-AC8F-C6E8AFCD145D-low.gif

where

  • tRESP is the time delay from the moment ITRAN is applied to the moment when IFB falls below 1 µA

Additional considerations for the selection of appropriate output capacitors include ripple-current, ESR, and ESL ratings necessary to meet reliability and ripple-voltage requirements. Detailed design criteria for these considerations are beyond the scope of this datasheet.