SLUSC36B November   2015  – January 2016 UCC28881

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Start-Up Operation
      2. 8.4.2 Feedback and Voltage Control Loop
      3. 8.4.3 PWM Controller
      4. 8.4.4 Current Limit
      5. 8.4.5 Inductor Current Runaway Protection
      6. 8.4.6 Over Temperature Protection
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 13-V, 225-mA High-Side Buck Converter
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Input Stage (RF, D2, D3, C1, C2, L2)
          2. 9.2.1.2.2 Regulator Capacitor (CVDD)
          3. 9.2.1.2.3 Freewheeling Diode (D1)
          4. 9.2.1.2.4 Output Capacitor (CL)
          5. 9.2.1.2.5 Pre-Load Resistor (RL)
          6. 9.2.1.2.6 Inductor (L1)
          7. 9.2.1.2.7 Feedback Path (CFB, RFB1 and RFB2) and Load Resistor (RL)
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Additional UCC28881 Application Topologies
        1. 9.2.2.1 Low-Side Buck and LED Driver - Direct Feedback (Level Shifted)
        2. 9.2.2.2 High-Side Buck Converter
        3. 9.2.2.3 Non-Isolated, Low-Side Buck-Boost Converter
        4. 9.2.2.4 Non-Isolated, High-Side Buck-Boost Converter
        5. 9.2.2.5 Non-Isolated Flyback Converter
        6. 9.2.2.6 Isolated Flyback Converter
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Device Support

12.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

12.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

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    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.3 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.