SLUSFK5 June   2024 UCC33410

ADVANCE INFORMATION  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Insulation Specifications
    6. 5.6 Safety-Related Certifications
    7. 5.7 Electrical Characteristics
    8. 5.8 External BOM Components
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Enable and Disable
      2. 6.3.2 Output Voltage Soft-Start and Steady-State Regulation
      3. 6.3.3 Protection Features
        1. 6.3.3.1 Input Under-voltage and Over-Voltage Lockout
        2. 6.3.3.2 Output Under-Voltage Protection
        3. 6.3.3.3 Output Over-Voltage Protection
        4. 6.3.3.4 Over-Temperature Protection
        5. 6.3.3.5 Fault Reporting and Auto-Restart
      4. 6.3.4 VCC Output Voltage Selection
      5. 6.3.5 VCC Load Recommended Operating Area
      6. 6.3.6 Electromagnetic Compatibility (EMC) Considerations
    4. 6.4 Device Functional Modes
    5. 6.5 Pre-Production Samples Operating Limits
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Device Support
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. Revision History
  11. 10Mechanical and Packaging Information

Package Options

Mechanical Data (Package|Pins)
  • |
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Overview

The UCC33410 device integrates a high-efficiency, low-emissions isolated DC/DC converter. Requiring minimum passive componenets to form a completely functional DC/DC power module, the device can deliver a maxiumum power of 1.0W across a 3kVRMS basic isolation barrier over a wide range of operating temperatures in a low profile , high power density VSON - 12-pin package.

The easy-to-use feature, low profile and high power density promotes this device for size limited, cost sensitive systems with a minimum design effort replacing bulky and expensive transformer based designs.

The integrated DC/DC converter uses switched mode operation and proprietary circuit techniques to reduce power losses and boost efficiency across all loading conditions. Specialized control mechanisms, clocking schemes, and the use of an on-chip transformer provide high efficiency and low radiated emissions.

The VINP supply is provided to the primary power controller that switches the power stage connected to the integrated transformer. Power is transferred to the secondary side, rectified, and regulated using a fast hysteritic burst mode control scheme that monitors VCC and ensures it is kept within the hysterisis band under normal and transient loading events while maintaining efficient operation across all loading conditions. The VCC is regulated to 3.3V or 3.7V by SEL pin connection to have enough headrome for a post regulator LDO for tighter regulation or lower output ripple requirement applications .

The device has an enable pin to turn the device on or off depending on the system requirement. Pulling enable pin low will reduce the quiscent current significantly if the system wants to operate in a low power conumption mode. The enable pin can also be used as a fault reporting pin, when connected to 18kΩ, the pin will be pulled low for 200μs for any fault shutdown of the device. The device has a soft-start mechanism for a smooth and fast VCC ramp up with minimum input inrush current to avoid oversizing front-end power supplies powering the device's input.