To ensure isolation performance between the primary and secondary side, one should avoid placing any PCB traces or copper below the driver device. A PCB cutout is recommended in order to prevent contamination that may compromise the UCC51870’s isolation performance.
For half-bridge, or high-side/low-side configurations, where the high-side and low-side drivers could operate with a DC-link voltage up to 1000 VDC, one should try to increase the creepage distance of the PCB layout between the high and low-side PCB traces.