SLUSF39A December   2022  – February 2024 UCC5880-Q1

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Power Supply Recommendations
    1. 5.1 VCC1
    2. 5.2 VCC2
    3. 5.3 VEE2
  7. 6Layout
    1. 6.1 Layout Guidelines
      1. 6.1.1 Component Placement
      2. 6.1.2 Grounding Considerations
      3. 6.1.3 High-Voltage Considerations
      4. 6.1.4 Thermal Considerations
    2. 6.2 Layout Example
  8. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Third-Party Products Disclaimer
    2. 7.2 Receiving Notification of Documentation Updates
    3. 7.3 Support Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DFC|32
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.2 Layout Example

Please refer to UCC5880EVM-057 Evaluation Module (EVM) design for layout example.

GUID-20221020-SS0I-X4JC-XC1F-JQC0HSFTWLLQ-low.svg Figure 6-1 2D Layout Example
GUID-20221020-SS0I-5CTM-DTDL-LXKDQN8XBJB6-low.svg Figure 6-2 3D Layout Example