SLUSG08 December   2024 UCC5881-Q1

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Device and Documentation Support
    1. 4.1 Device Support
      1. 4.1.1 Third-Party Products Disclaimer
    2. 4.2 Receiving Notification of Documentation Updates
    3. 4.3 Support Resources
    4. 4.4 Trademarks
    5. 4.5 Electrostatic Discharge Caution
    6. 4.6 Glossary
  6. 5Revision History
  7. 6Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DFC|32
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Dual-output driver with real time variable drive strength
    • ±15A and ±5A drive current outputs
    • Digital input pins (GD*) for drive strength adjustment without SPI
    • 3 resistor settings R1, R2, or R1||R2
    • Integrated 4A active Miller clamp or optional external drive for Miller clamp transistor
  • Primary-side and secondary-side active short circuit (ASC) support
  • Under-voltage and over-voltage protection on internal and external supplies
  • Driver die temperature sensing and over temperature protection
  • Short-circuit protection:
    • 110ns response time to DESAT event
    • DESAT protection – selections up to 14V
    • Shunt resistor based short-circuit (SC) and over-current (OC) protection
    • Configurable protection threshold values and blanking times
    • Programmable soft turn-off (STO) and two-level soft turn-off (2STO) current
  • Integrated 10-bit ADC
    • Able to measure power switch temperature, DC Link voltage, driver die temperature, DESAT pin voltage, VCC2 voltage
    • Programmable digital comparators
  • Advanced VCE/VDS clamping circuit
  • Functional Safety-Compliant
  • Integrated diagnostics:
    • Built in self-test (BIST) for protection comparators
    • Gate threshold voltage measurement for power device health monitoring
    • INP to transistor gate path integrity
    • Internal clock monitoring
    • Fault alarm and warning outputs (nFLT*)
    • ISO communication data integrity check
  • SPI based device reconfiguration, verification, supervision, and diagnosis
  • 150V/ns CMTI
  • AEC-Q100 qualified with the following results:
    • Device temperature grade 1: -40°C to +125°C ambient operating temperature
    • Device HBM ESD classification level 2
    • Device CDM ESD classification level C2b