SLUSB72D March   2013  – April 2021 UCD3138064

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Functional Block Diagram
  5. 5 Revision History
  6. 6 Device Options
    1. 6.1 Device Comparison Table
    2. 6.2 Product Selection Matrix
  7. 7 Pin Configuration and Functions
    1. 7.1 Pin Diagrams
    2. 7.2 Pin Functions
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings (1)
    2. 8.2  Handling Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information
    5. 8.5  Electrical Characteristics
    6. 8.6  Timing Characteristics
    7. 8.7  PMBus/SMBus/I2C Timing
    8. 8.8  Power On Reset (POR) / Brown Out Reset (BOR)
    9. 8.9  Typical Clock Gating Power Savings
    10. 8.10 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
      1. 9.1.1 ARM Processor
      2. 9.1.2 Memory
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  System Module
        1. 9.3.1.1 Address Decoder (DEC)
        2. 9.3.1.2 Memory Management Controller (MMC)
        3. 9.3.1.3 System Management (SYS)
        4. 9.3.1.4 Central Interrupt Module (CIM)
      2. 9.3.2  Peripherals
        1. 9.3.2.1 Digital Power Peripherals
          1. 9.3.2.1.1 Front End
          2. 9.3.2.1.2 DPWM Module
          3. 9.3.2.1.3 DPWM Events
          4. 9.3.2.1.4 High Resolution DPWM
          5. 9.3.2.1.5 Over Sampling
          6. 9.3.2.1.6 DPWM Interrupt Generation
          7. 9.3.2.1.7 DPWM Interrupt Scaling/Range
      3. 9.3.3  Automatic Mode Switching
        1. 9.3.3.1 Phase Shifted Full Bridge Example
        2. 9.3.3.2 LLC Example
        3. 9.3.3.3 Mechanism For Automatic Mode Switching
      4. 9.3.4  DPWMC, Edge Generation, Intramux
      5. 9.3.5  Filter
        1. 9.3.5.1 Loop Multiplexer
        2. 9.3.5.2 Fault Multiplexer
      6. 9.3.6  Communication Ports
        1. 9.3.6.1 SCI (UART) Serial Communication Interface
        2. 9.3.6.2 PMBUS/I2C
        3. 9.3.6.3 SPI
      7. 9.3.7  Real Time Clock
      8. 9.3.8  Timers
        1. 9.3.8.1 24-Bit Timer
        2. 9.3.8.2 16-Bit PWM Timers
        3. 9.3.8.3 Watchdog Timer
      9. 9.3.9  General Purpose ADC12
      10. 9.3.10 Miscellaneous Analog
      11. 9.3.11 Brownout
      12. 9.3.12 Global I/O
      13. 9.3.13 Temperature Sensor Control
      14. 9.3.14 I/O Mux Control
      15. 9.3.15 Current Sharing Control
      16. 9.3.16 Temperature Reference
    4. 9.4 Device Functional Modes
      1. 9.4.1 DPWM Modes Of Operation
        1. 9.4.1.1 Normal Mode
        2. 9.4.1.2 Phase Shifting
        3. 9.4.1.3 DPWM Multiple Output Mode
        4. 9.4.1.4 DPWM Resonant Mode
      2. 9.4.2 Triangular Mode
      3. 9.4.3 Leading Edge Mode
    5. 9.5 Memory
      1. 9.5.1 Register Maps
        1. 9.5.1.1 CPU Memory Map and Interrupts
          1. 9.5.1.1.1 Memory Map (After Reset Operation)
          2. 9.5.1.1.2 Memory Map (Normal Operation)
          3. 9.5.1.1.3 Memory Map (System and Peripherals Blocks)
        2. 9.5.1.2 Boot ROM
        3. 9.5.1.3 Customer Boot Program
        4. 9.5.1.4 Flash Management
        5. 9.5.1.5 Synchronous Rectifier MOSFET Ramp and IDE Calculation
  10. 10Applications and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 PCMC (Peak Current Mode Control) PSFB (Phase Shifted Full Bridge) Hardware Configuration Overview
        2. 10.2.2.2 DPWM Initialization for PSFB
          1. 10.2.2.2.1 DPWM Synchronization
        3. 10.2.2.3 Fixed Signals to Bridge
        4. 10.2.2.4 Dynamic Signals to Bridge
        5. 10.2.2.5 System Initialization for PCM
          1. 10.2.2.5.1 Use of Front Ends and Filters in PSFB
          2. 10.2.2.5.2 Peak Current Detection
          3. 10.2.2.5.3 Peak Current Mode (PCM)
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 Introduction To Power Supply and Layout Recommendations
    2. 11.2 3.3-V Supply Pins
    3. 11.3 Recommendation for V33 Ramp up Slew Rate for UCD3138 and UCD3138064
    4. 11.4 Recommendation for RC Time Constant of RESET Pin for UCD3138 and UCD3138064
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 EMI and EMC Mitigation Guidelines
      2. 12.1.2 BP18 Pin
      3. 12.1.3 Additional Bias Guidelines
      4. 12.1.4 UART Communication Port
    2. 12.2 Layout Example
      1. 12.2.1 UCD3138 and UCD3138064 40 Pin
      2. 12.2.2 UCD3138 and UCD3138064 64 Pin
  13. 13Device and Documentation Support
    1. 13.1 Device Support
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Revision History

Changes from Revision C (March 2017) to Revision D (April 2021)

  • Add 40 pin RJA Package option (global). Change sync feature description to say it works with all UCD3138 family members instead of just UCD3138064. Split Device Overview section into 4 sections to conform to TI data sheet standards. Go
  • Add RJA Package to Device Information table. Change number of ADC channels from 14 to 15, because channels 0 to 13 are for external pins, and channel 14 is for the internal temperature sensor.Go
  • Add RJA package for new designs note Go
  • Added RJA to top line, deleted empty column, deleted row with External Crystal Clock Support, since only UCD3138128A supports it Go
  • Add RJA Package top view, as well as notes about corner pad soldering and reliability for both RMH and RJA packages.Go
  • Add DAC Output as an alternate pin assignment for pins 2, 3, and 4 on the 40 pin QFN package table. Change package descriptions in tables for clarity and consistencyGo
  • Add reference to IC Package Thermal Metrics application report in thermal table Go
  • Add RJA package to thermal table Go
  • Fixed cross reference for current share resistor and current source Go
  • Rise and fall time descriptions were switched to make them match the data. Before the rise time spec was in the row for fall times and vice versa. They were labeled correctly, so the error was obviousGo
  • Add "Using Front End EADCs" to the bullet describing the digital comparatorsGo
  • Remove pin numbers from table, as they were unnecessary and only applied to 64 pin package. Add note that Global I/O settings travel with the pin and don't move when the IOMUX register moves the pin function to another pin. Go
  • Changed temperature sensor ADC channel from 15 to 14 Go
  • Replaced the Device Grounding and Layout Guidelines sub -section with the Power Supply Recommendations Section and Layout Section. The new content is copied directly from the UCD3138 Family Practical Design Guideline Application Note. Go
  • Update links and references to latest tool and document set Go

Changes from Revision B (September 2014) to Revision C (March 2017)

  • Changed Device Grounding and Layout Guidelines section Go

Changes from Revision A (February 2014) to Revision B (July 2014)

  • Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Added 40-pin RMH QFN package option (global).Go

Changes from Revision * (March 2013) to Revision A (February 2014)

  • Finalize for release. Changed rev to A.Go
  • Deleted table: Summary Of Key Differences Between UCD3138x & UCD3138Go