SLVSAN9C
April 2011 – March 2019
UCD90120A
PRODUCTION DATA.
1
Features
2
Applications
3
Description
Simplified Schematic
4
Revision History
5
Pin Configuration and Functions
Pin Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
I2C/SMBus/PMBus Timing Requirements
6.7
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
TI Fusion GUI
7.3.2
PMBus Interface
7.3.3
Rail Configuration
7.4
Device Functional Modes
7.4.1
Power-Supply Sequencing
7.4.1.1
Turn-On Sequencing
7.4.1.2
Turn-Off Sequencing
7.4.1.3
Sequencing Configuration Options
7.4.2
Pin-Selected Rail States
7.4.3
Monitoring
7.4.3.1
Voltage Monitoring
7.4.3.2
Current Monitoring
7.4.3.3
Remote Temperature Monitoring and Internal Temperature Sensor
7.4.3.4
Temperature by Host Input
7.4.4
Fault Responses and Alert Processing
7.4.5
Shut Down All Rails and Sequence On (Resequence)
7.4.6
GPIOs
7.4.7
GPO Control
7.4.8
GPO Dependencies
7.4.9
GPO Delays
7.4.10
State Machine Mode Enable
7.4.11
GPI Special Functions
7.4.12
Power-Supply Enables
7.4.13
Cascading Multiple Devices
7.4.14
PWM Outputs
7.4.14.1
FPWM1-8
7.4.14.2
PWM1-4
7.4.15
Programmable Multiphase PWMs
7.4.16
Margining
7.4.16.1
Open-Loop Margining
7.4.16.2
Closed-Loop Margining
7.4.17
System Reset Signal
7.4.18
Watch Dog Timer
7.4.19
Run Time Clock
7.4.20
Data and Error Logging to Flash Memory
7.4.21
Brownout Function
7.4.22
PMBus Address Selection
7.5
Programming
7.5.1
Device Configuration and Programming
7.5.1.1
Full Configuration Update While in Normal Mode
7.5.2
JTAG Interface
7.5.3
Internal Fault Management and Memory Error Correction (ECC)
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
Estimating ADC Reporting Accuracy
8.2.3
Application Curves
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
11
Device and Documentation Support
11.1
Documentation Support
11.1.1
Related Documentation
11.2
Community Resources
11.3
Trademarks
11.4
Electrostatic Discharge Caution
11.5
Glossary
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RGC|64
MPQF125F
Thermal pad, mechanical data (Package|Pins)
RGC|64
QFND102O
Orderable Information
slvsan9c_oa
slvsan9c_pm
10.2
Layout Example
Figure 35.
Example Layout – PCB Top Layer
Figure 36.
Example Layout – PCB Bottom Layer