SLVSAN9C April   2011  – March  2019 UCD90120A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C/SMBus/PMBus Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 TI Fusion GUI
      2. 7.3.2 PMBus Interface
      3. 7.3.3 Rail Configuration
    4. 7.4 Device Functional Modes
      1. 7.4.1  Power-Supply Sequencing
        1. 7.4.1.1 Turn-On Sequencing
        2. 7.4.1.2 Turn-Off Sequencing
        3. 7.4.1.3 Sequencing Configuration Options
      2. 7.4.2  Pin-Selected Rail States
      3. 7.4.3  Monitoring
        1. 7.4.3.1 Voltage Monitoring
        2. 7.4.3.2 Current Monitoring
        3. 7.4.3.3 Remote Temperature Monitoring and Internal Temperature Sensor
        4. 7.4.3.4 Temperature by Host Input
      4. 7.4.4  Fault Responses and Alert Processing
      5. 7.4.5  Shut Down All Rails and Sequence On (Resequence)
      6. 7.4.6  GPIOs
      7. 7.4.7  GPO Control
      8. 7.4.8  GPO Dependencies
      9. 7.4.9  GPO Delays
      10. 7.4.10 State Machine Mode Enable
      11. 7.4.11 GPI Special Functions
      12. 7.4.12 Power-Supply Enables
      13. 7.4.13 Cascading Multiple Devices
      14. 7.4.14 PWM Outputs
        1. 7.4.14.1 FPWM1-8
        2. 7.4.14.2 PWM1-4
      15. 7.4.15 Programmable Multiphase PWMs
      16. 7.4.16 Margining
        1. 7.4.16.1 Open-Loop Margining
        2. 7.4.16.2 Closed-Loop Margining
      17. 7.4.17 System Reset Signal
      18. 7.4.18 Watch Dog Timer
      19. 7.4.19 Run Time Clock
      20. 7.4.20 Data and Error Logging to Flash Memory
      21. 7.4.21 Brownout Function
      22. 7.4.22 PMBus Address Selection
    5. 7.5 Programming
      1. 7.5.1 Device Configuration and Programming
        1. 7.5.1.1 Full Configuration Update While in Normal Mode
      2. 7.5.2 JTAG Interface
      3. 7.5.3 Internal Fault Management and Memory Error Correction (ECC)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Estimating ADC Reporting Accuracy
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1 Layout Guidelines

The thermal pad provides a thermal and mechanical interface between the device and the printed circuit board (PCB). Connect the exposed thermal pad of the PCB to the device VSS pins and provide at least a 4 × 4 pattern of PCB vias to connect the thermal pad and VSS pins to the circuit ground on other PCB layers.

For supply-voltage decoupling, provide power-supply pin bypass to the device as follows:

  • 1-μF, X7R ceramic in parallel with 0.01-μF, X7R ceramic at pin 47 (BPCAP)
  • 0.1-μF, X7R ceramic in parallel with 4.7-μF, X5R ceramic at pin 44 (V33DIO2) and 45 (V33D)
  • 0.1-μF, X7R ceramic at pin 7 (V33DIO1)
  • 0.1-μF, X7R ceramic in parallel with 4.7-μF, X5R ceramic at pin 46 (V33A)
  • Connect V33D (pin 45), V33DIO1 (pin 7) and V33DIO2 (pin 44) to 3.3-V supply directly. Connect V33A (pin 46) to V33D through a 4.99-Ω resistor. This resistor and V33A decoupling capacitors form a low-pass filter to reduce noise on V33A.
Depending on use and application of the various GPIO signals used as digital outputs, some impedance control may be desired to quiet fast signal edges. For example, when using the FPWM pins for voltage margining, the pin is configured as a digital clock signal. Route these signals away from sensitive analog signals. It is also good design practice to provide a series impedance of 20 Ω to 33 Ω at the signal source to slow the fast-digital edges.