SLVSAC8D November   2010  – April  2019 UCD90160

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Simplified Application Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements: I2C/SMBus/PMBus
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Rail Configuration
      2. 7.3.2 TI Fusion GUI
      3. 7.3.3 PMBus Interface
    4. 7.4 Device Functional Modes
      1. 7.4.1  Power-Supply Sequencing
        1. 7.4.1.1 Turn-on Sequencing
        2. 7.4.1.2 Turn-off Sequencing
        3. 7.4.1.3 Sequencing Configuration Options
      2. 7.4.2  Pin-Selected Rail States
      3. 7.4.3  Voltage Monitoring
      4. 7.4.4  Fault Responses and Alert Processing
      5. 7.4.5  Shut Down All Rails and Sequence On (Resequence)
      6. 7.4.6  GPIOs
      7. 7.4.7  GPO Control
      8. 7.4.8  GPO Dependencies
        1. 7.4.8.1 GPO Delays
        2. 7.4.8.2 State Machine Mode Enable
      9. 7.4.9  GPI Special Functions
      10. 7.4.10 Power-Supply Enables
      11. 7.4.11 Cascading Multiple Devices
      12. 7.4.12 PWM Outputs
        1. 7.4.12.1 FPWM1-8
        2. 7.4.12.2 PWM1-4
      13. 7.4.13 Programmable Multiphase PWMs
      14. 7.4.14 Margining
        1. 7.4.14.1 Open-Loop Margining
        2. 7.4.14.2 Closed-Loop Margining
      15. 7.4.15 System Reset Signal
      16. 7.4.16 Watch Dog Timer
      17. 7.4.17 Run Time Clock
      18. 7.4.18 Data and Error Logging to Flash Memory
      19. 7.4.19 Brownout Function
      20. 7.4.20 PMBus Address Selection
    5. 7.5 Programming
      1. 7.5.1 Device Configuration and Programming
        1. 7.5.1.1 Full Configuration Update While in Normal Mode
      2. 7.5.2 JTAG Interface
      3. 7.5.3 Internal Fault Management and Memory Error Correction (ECC)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
      4. 8.2.4 Estimating ADC Reporting Accuracy
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from C Revision (August 2017) to D Revision

Changes from B Revision (December 2015) to C Revision

  • Changed Layout Guidelines 1st bullet From "0.1-µF, X7R ....." To " 1-μF, X7R ceramic in parallel with 0.01-μF, X7R ceramic at pin 47 (BPCAP)"Go

Changes from A Revision (September 2011) to B Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Changed second sentence in VOLTAGE MONITORING section FROM:....62, 63, and 63 TO: ...62, and 63Go
  • Deleted in second paragraph 'and 62.2 us to convert all 16 of the analog inputs.'Go
  • Changed the first sentence, first paragraph in Fault Responses and Alert Processing FROM: Device monitors....operation....TO: The UCD90160 monitors....normal operation.Go
  • Changed first list item in GPI Special Functions section FROM: Sequencing....good state. TO: GPI Fault Enable....as a fault.Go
  • Deleted Device Reset section.Go
  • Moved Device Configuration and Programming, JTAG Interface, and Internal Fault Management and Memory Error Correction (ECC) sections into the Programming section.Go
  • Changed second sentence in first paragraph under Figure 27, per the Errata document.Go
  • Added new paragraph in JTAG Interface section. Go
  • Moved Estimating ADC Reporting Accuracy section, it now follows the Application Curves section. Go

Changes from * Revision (November 2010) to A Revision

  • Changed Timing requirements table (tf) From: See (Note Rise Time) To: See (Note Fall Time)Go
  • Changed Timing requirements table (tr) From: See (Note Fall Time) To: See (Note Rise Time)Go