SLRS060C May   2012  – November 2016 ULN2003V12

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Diagram
    3. 7.3 Feature Description
      1. 7.3.1 TTL and Other Logic Inputs
      2. 7.3.2 Input RC Snubber
      3. 7.3.3 High-impedance Input Drivers
    4. 7.4 Device Functional Modes
  8. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Unipolar Stepper Motor Driver
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Application Curves
      2. 8.2.2 Inverting Logic Level Shifter
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
      3. 8.2.3 Maximum Supply Selector
        1. 8.2.3.1 Design Requirements
      4. 8.2.4 Constant Current LED Driver
        1. 8.2.4.1 Design Requirements
      5. 8.2.5 NOR Logic Driver
        1. 8.2.5.1 Design Requirements
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
      1. 10.3.1 On-chip Power Dissipation
      2. 10.3.2 Thermal Reliability
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Layout

10.1 Layout Guidelines

Thin traces can be used on the input due to the low current logic that is typically used to drive ULN2003V12. Take care to separate the input channels as much as possible, as to eliminate cross-talk. TI recommends thick traces for the output to drive high currents that may be required. Wire thickness can be determined by the trace material's current density and desired drive current. Because all of the channels currents return to a common ground, it is best to size that trace width to be very wide. Some applications require up to 1 A.

10.2 Layout Example

ULN2003V12 LayoutExample.gif

10.3 Thermal Considerations

10.3.1 On-chip Power Dissipation

Use Equation 3 to calculate ULN2003V12 on-chip power dissipation PD.

Equation 3. ULN2003V12 eq1_lrs059.gif

where

  • N is the number of channels active together
  • VOLi is the OUTi pin voltage for the load current ILi

10.3.2 Thermal Reliability

TI recommends limiting the ULN2003V12 IC’s die junction temperature to less than 125°C. The IC junction temperature is directly proportional to the on-chip power dissipation. Use Equation 4 to calculate the maximum allowable on-chip power dissipation for a target IC junction temperature.

Equation 4. ULN2003V12 eq2_lrs059.gif

where

  • TJ(MAX) is the target maximum junction temperature
  • TA is the operating ambient temperature
  • θJA is the package junction to ambient thermal resistance