Integrates RF, power amplifiers (PAs), clock, RF switches, filters, passives, and power
management
Quick hardware design with TI module collateral and reference designs
Operating temperature: –20°C to +70°C
Small form factor: 13.3 × 13.4 × 2 mm
100-pin MOC package
FCC, IC, ETSI/CE, and TELEC certified with PCB, dipole, chip, and PIFA antennas
Wi-Fi®
WLAN baseband processor and RF transceiver support of IEEE Std 802.11b, 802.11g, and 802.11n
20- and 40-MHz SISO and 20-MHz 2 × 2 MIMO at 2.4 GHz for high throughput: 80 Mbps (TCP),
100 Mbps (UDP)
2.4-GHz MRC support for extended range
Fully calibrated: production calibration not required
4-bit SDIO host interface support
Wi-Fi direct concurrent operation (multichannel, multirole)
Bluetooth® and Bluetooth low energy (WL183xMOD only)
Bluetooth 5.1 secure connection compliant and CSA2 support (declaration ID: D032799)
Host controller interface (HCI) transport for Bluetooth over UART
Dedicated audio processor support of SBC encoding + A2DP
Dual-mode Bluetooth and Bluetooth low energy
TI's Bluetooth and Bluetooth low energy certified stack
Key benefits
Reduces design overhead
Differentiated use cases by configuring WiLink™ 8 simultaneously in two roles (STA and AP) to connect directly with other
Wi-Fi devices on different RF channel (Wi-Fi networks)
Best-in-class Wi-Fi with high-performance audio and video streaming reference
applications with up to 1.4× the range versus one antenna
Different provisioning methods for in-home devices connectivity to Wi-Fi in one step
Lowest Wi-Fi power consumption in connected idle (< 800 µA)
Configurable wake on WLAN filters to only wake up the system