SWRS152N June   2013  – April 2021 WL1801MOD , WL1805MOD , WL1831MOD , WL1835MOD

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Functional Block Diagram
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Attributes
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  External Digital Slow Clock Requirements
    5. 8.5  Thermal Resistance Characteristics for MOC 100-Pin Package
    6. 8.6  WLAN Performance: 2.4-GHz Receiver Characteristics
    7. 8.7  WLAN Performance: 2.4-GHz Transmitter Power
    8. 8.8  WLAN Performance: Currents
    9. 8.9  Bluetooth Performance: BR, EDR Receiver Characteristics—In-Band Signals
    10. 8.10 Bluetooth Performance: Transmitter, BR
    11. 8.11 Bluetooth Performance: Transmitter, EDR
    12. 8.12 Bluetooth Performance: Modulation, BR
    13. 8.13 Bluetooth Performance: Modulation, EDR
    14. 8.14 Bluetooth low energy Performance: Receiver Characteristics – In-Band Signals
    15. 8.15 Bluetooth low energy Performance: Transmitter Characteristics
    16. 8.16 Bluetooth low energy Performance: Modulation Characteristics
    17. 8.17 Bluetooth BR and EDR Dynamic Currents
    18. 8.18 Bluetooth low energy Currents
    19. 8.19 Timing and Switching Characteristics
      1. 8.19.1 Power Management
        1. 8.19.1.1 Block Diagram – Internal DC-DCs
      2. 8.19.2 Power-Up and Shut-Down States
      3. 8.19.3 Chip Top-level Power-Up Sequence
      4. 8.19.4 WLAN Power-Up Sequence
      5. 8.19.5 Bluetooth-Bluetooth low energy Power-Up Sequence
      6. 8.19.6 WLAN SDIO Transport Layer
        1. 8.19.6.1 SDIO Timing Specifications
        2. 8.19.6.2 SDIO Switching Characteristics – High Rate
      7. 8.19.7 HCI UART Shared-Transport Layers for All Functional Blocks (Except WLAN)
        1. 8.19.7.1 UART 4-Wire Interface – H4
      8. 8.19.8 Bluetooth Codec-PCM (Audio) Timing Specifications
  9. 9 Detailed Description
    1. 9.1 WLAN Features
    2. 9.2 Bluetooth Features
    3. 9.3 Bluetooth Low Energy Features
    4. 9.4 Device Certification
      1. 9.4.1 FCC Certification and Statement
      2. 9.4.2 Innovation, Science, and Economic Development Canada (ISED)
      3. 9.4.3 ETSI/CE
      4. 9.4.4 MIC Certification
    5. 9.5 Module Markings
    6. 9.6 Test Grades
    7. 9.7 End Product Labeling
    8. 9.8 Manual Information to the End User
  10. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
      1. 10.1.1 Typical Application – WL1835MODGB Reference Design
      2. 10.1.2 Design Recommendations
      3. 10.1.3 RF Trace and Antenna Layout Recommendations
      4. 10.1.4 Module Layout Recommendations
      5. 10.1.5 Thermal Board Recommendations
      6. 10.1.6 Baking and SMT Recommendations
        1. 10.1.6.1 Baking Recommendations
        2. 10.1.6.2 SMT Recommendations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
        1. 11.1.2.1 Tools and Software
      3. 11.1.3 Device Support Nomenclature
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 TI Module Mechanical Outline
    2. 12.2 Tape and Reel Information
      1. 12.2.1 Tape and Reel Specification
      2. 12.2.2 Packing Specification
        1. 12.2.2.1 Reel Box
        2. 12.2.2.2 Shipping Box
    3. 12.3 Packaging Information
      1. 12.3.1 PACKAGE OPTION ADDENDUM

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • MOC|100
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1.1 Typical Application – WL1835MODGB Reference Design

Figure 10-1 shows the TI WL1835MODGB reference design.

GUID-9CABFE25-6943-442C-974F-9E9A771DAEF8-low.gif Figure 10-1 TI Module Reference Schematics

Table 10-1 lists the bill materials (BOM).

Table 10-1 BOM
ITEM DESCRIPTION PART NUMBER PACKAGE REF. QTY MFR
1 TI WL1835 Wi-Fi / Bluetooth module WL1835MODGI 13.4 x 13.3 x 2.0 mm U1 1 TI
2 XOSC 3225 / 32.768 kHz / 1.8 V / ±50 ppm 7XZ3200005 3.2 x 2.5 x 1.0 mm OSC1 1 TXC
3 Antenna / chip / 2.4 and 5 GHz / peak gain > 5 dBi ANT016008LCD2442MA1 1.6 mm x 0.8 mm ANT1, ANT2 2 TDK
6 Mini RF header receptacle U.FL-R-SMT-1 (10) 3.0 x 2.6 x 1.25 mm J5, J6 2 Hirose
7 Inductor 0402 / 1.1 nH / ±0.05 nH SMD LQP15MN1N1W02 0402 L1 1 Murata
8 Inductor 0402 / 1.5 nH / ±0.05 nH SMD LQP15MN1N5W02 0402 L2 1 Murata
9 Capacitor 0402 / 1.2 pF / 50 V / C0G / ±0.1 pF GJM1555C1H1R2BB01 0402 C11 1 Murata
10 Capacitor 0402 / 2.2 pF / 50 V / C0G / ±0.1 pF GJM1555C1H1R2BB01 0402 C9 1 Murata
11 Capacitor 0402 / 4 pF / 50 V / C0G / ±0.1 pF GJM1555C1H4R0BB01 0402 C14 1 Murata
12 Capacitor 0402 / 8 pF / 50 V / C0G / ±0.1 pF GJM1555C1H8R0BB01 0402 C13 1 Walsin
13 Capacitor 0402 / 10 pF / 50 V / NPO / ±5% 0402N100J500LT 0402 C5, C6 2 Walsin
14 Capacitor 0402 / 0.1 µF / 10 V / X7R / ±10% 0402B104K100CT 0402 C3, C4 1 Walsin
15 Capacitor 0402 / 1 µF / 6.3 V / X5R / ±10% / HF GRM155R60J105KE19D 0402  C1 1 Murata
16 Capacitor 0603 / 10 µF / 6.3 V / X5R / ±20% C1608X5R0J106M 0603 C2 1 TDK