SWRS170K March   2014  – November 2023 WL1807MOD , WL1837MOD

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Revision History
  7. 6 Device Comparison
    1. 6.1 Related Products
  8. 7 Terminal Configuration and Functions
    1. 7.1 Pin Attributes
  9. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  External Digital Slow Clock Requirements
    5. 8.5  Thermal Resistance Characteristics for MOC 100-Pin Package
    6. 8.6  WLAN Performance: 2.4-GHz Receiver Characteristics
    7. 8.7  WLAN Performance: 2.4-GHz Transmitter Power
    8. 8.8  WLAN Performance: 5-GHz Receiver Characteristics
    9. 8.9  WLAN Performance: 5-GHz Transmitter Power
    10. 8.10 WLAN Performance: Currents
    11. 8.11 Bluetooth Performance: BR, EDR Receiver Characteristics—In-Band Signals
    12. 8.12 Bluetooth Performance: Transmitter, BR
    13. 8.13 Bluetooth Performance: Transmitter, EDR
    14. 8.14 Bluetooth Performance: Modulation, BR
    15. 8.15 Bluetooth Performance: Modulation, EDR
    16. 8.16 Bluetooth low energy Performance: Receiver Characteristics – In-Band Signals
    17. 8.17 Bluetooth low energy Performance: Transmitter Characteristics
    18. 8.18 Bluetooth low energy Performance: Modulation Characteristics
    19. 8.19 Bluetooth BR and EDR Dynamic Currents
    20. 8.20 Bluetooth low energy Currents
    21. 8.21 Timing and Switching Characteristics
      1. 8.21.1 Power Management
        1. 8.21.1.1 Block Diagram – Internal DC-DCs
      2. 8.21.2 Power-Up and Shut-Down States
      3. 8.21.3 Chip Top-level Power-Up Sequence
      4. 8.21.4 WLAN Power-Up Sequence
      5. 8.21.5 Bluetooth-Bluetooth low energy Power-Up Sequence
      6. 8.21.6 WLAN SDIO Transport Layer
        1. 8.21.6.1 SDIO Timing Specifications
        2. 8.21.6.2 SDIO Switching Characteristics – High Rate
      7. 8.21.7 HCI UART Shared-Transport Layers for All Functional Blocks (Except WLAN)
        1. 8.21.7.1 UART 4-Wire Interface – H4
      8. 8.21.8 Bluetooth Codec-PCM (Audio) Timing Specifications
  10. 9 Detailed Description
    1. 9.1 WLAN Features
    2. 9.2 Bluetooth Features
    3. 9.3 Bluetooth Low Energy Features
    4. 9.4 Device Certification
      1. 9.4.1 FCC Certification and Statement
      2. 9.4.2 Innovation, Science, and Economic Development Canada (ISED)
      3. 9.4.3 ETSI/CE
      4. 9.4.4 MIC Certification
    5. 9.5 Module Markings
    6. 9.6 Test Grades
    7. 9.7 End Product Labeling
    8. 9.8 Manual Information to the End User
  11. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
      1. 10.1.1 Typical Application – WL1837MOD Reference Design
      2. 10.1.2 Design Recommendations
      3. 10.1.3 RF Trace and Antenna Layout Recommendations
      4. 10.1.4 Module Layout Recommendations
      5. 10.1.5 Thermal Board Recommendations
      6. 10.1.6 Baking and SMT Recommendations
        1. 10.1.6.1 Baking Recommendations
        2. 10.1.6.2 SMT Recommendations
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
        1. 11.1.2.1 Tools and Software
      3. 11.1.3 Device Support Nomenclature
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 TI Module Mechanical Outline
    2. 12.2 Tape and Reel Information
      1. 12.2.1 Tape and Reel Specification
      2. 12.2.2 Packing Specification
        1. 12.2.2.1 Reel Box
        2. 12.2.2.2 Shipping Box
    3. 12.3 Packaging Information
      1. 12.3.1 PACKAGE OPTION ADDENDUM

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • MOC|100
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1.5 Thermal Board Recommendations

The TI module uses µvias for layers 1 through 6 with full copper filling, providing heat flow all the way to the module ground pads.

TI recommends using one big ground pad under the module with vias all the way to connect the pad to all ground layers (see Figure 10-5).

GUID-89E32919-2CAB-4DC3-8136-D61632914FC0-low.gif Figure 10-5 Block of Ground Pads on Bottom Side of Package

Figure 10-6 shows via array patterns, which are applied wherever possible to connect all of the layers to the TI module central or main ground pads.

GUID-23EE2E35-06AA-4C5B-A16F-661B16FA35E4-low.gif Figure 10-6 Via Array Patterns