SWRS152N June   2013  – April 2021 WL1801MOD , WL1805MOD , WL1831MOD , WL1835MOD

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Functional Block Diagram
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Attributes
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  External Digital Slow Clock Requirements
    5. 8.5  Thermal Resistance Characteristics for MOC 100-Pin Package
    6. 8.6  WLAN Performance: 2.4-GHz Receiver Characteristics
    7. 8.7  WLAN Performance: 2.4-GHz Transmitter Power
    8. 8.8  WLAN Performance: Currents
    9. 8.9  Bluetooth Performance: BR, EDR Receiver Characteristics—In-Band Signals
    10. 8.10 Bluetooth Performance: Transmitter, BR
    11. 8.11 Bluetooth Performance: Transmitter, EDR
    12. 8.12 Bluetooth Performance: Modulation, BR
    13. 8.13 Bluetooth Performance: Modulation, EDR
    14. 8.14 Bluetooth low energy Performance: Receiver Characteristics – In-Band Signals
    15. 8.15 Bluetooth low energy Performance: Transmitter Characteristics
    16. 8.16 Bluetooth low energy Performance: Modulation Characteristics
    17. 8.17 Bluetooth BR and EDR Dynamic Currents
    18. 8.18 Bluetooth low energy Currents
    19. 8.19 Timing and Switching Characteristics
      1. 8.19.1 Power Management
        1. 8.19.1.1 Block Diagram – Internal DC-DCs
      2. 8.19.2 Power-Up and Shut-Down States
      3. 8.19.3 Chip Top-level Power-Up Sequence
      4. 8.19.4 WLAN Power-Up Sequence
      5. 8.19.5 Bluetooth-Bluetooth low energy Power-Up Sequence
      6. 8.19.6 WLAN SDIO Transport Layer
        1. 8.19.6.1 SDIO Timing Specifications
        2. 8.19.6.2 SDIO Switching Characteristics – High Rate
      7. 8.19.7 HCI UART Shared-Transport Layers for All Functional Blocks (Except WLAN)
        1. 8.19.7.1 UART 4-Wire Interface – H4
      8. 8.19.8 Bluetooth Codec-PCM (Audio) Timing Specifications
  9. 9 Detailed Description
    1. 9.1 WLAN Features
    2. 9.2 Bluetooth Features
    3. 9.3 Bluetooth Low Energy Features
    4. 9.4 Device Certification
      1. 9.4.1 FCC Certification and Statement
      2. 9.4.2 Innovation, Science, and Economic Development Canada (ISED)
      3. 9.4.3 ETSI/CE
      4. 9.4.4 MIC Certification
    5. 9.5 Module Markings
    6. 9.6 Test Grades
    7. 9.7 End Product Labeling
    8. 9.8 Manual Information to the End User
  10. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
      1. 10.1.1 Typical Application – WL1835MODGB Reference Design
      2. 10.1.2 Design Recommendations
      3. 10.1.3 RF Trace and Antenna Layout Recommendations
      4. 10.1.4 Module Layout Recommendations
      5. 10.1.5 Thermal Board Recommendations
      6. 10.1.6 Baking and SMT Recommendations
        1. 10.1.6.1 Baking Recommendations
        2. 10.1.6.2 SMT Recommendations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
        1. 11.1.2.1 Tools and Software
      3. 11.1.3 Device Support Nomenclature
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 TI Module Mechanical Outline
    2. 12.2 Tape and Reel Information
      1. 12.2.1 Tape and Reel Specification
      2. 12.2.2 Packing Specification
        1. 12.2.2.1 Reel Box
        2. 12.2.2.2 Shipping Box
    3. 12.3 Packaging Information
      1. 12.3.1 PACKAGE OPTION ADDENDUM

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • MOC|100
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.17 Bluetooth BR and EDR Dynamic Currents

Current is measured at output power as follows: BR at 11.7 dBm; EDR at 7.2 dBm.
USE CASE(1)(2)TYPUNIT
BR voice HV3 + sniff11.6mA
EDR voice 2-EV3 no retransmission + sniff5.9mA
Sniff 1 attempt 1.28 s178.0µA
EDR A2DP EDR2 (master). SBC high quality – 345 kbps10.4mA
EDR A2DP EDR2 (master). MP3 high quality – 192 kbps7.5mA
Full throughput ACL RX: RX-2DH5(3)(4)18.0mA
Full throughput BR ACL TX: TX-DH5(4)50.0mA
Full throughput EDR ACL TX: TX-2DH5(4)33.0mA
Page scan or inquiry scan (scan interval is 1.28 s or 11.25 ms, respectively)253.0µA
Page scan and inquiry scan (scan interval is 1.28 s and 2.56 s, respectively)332.0µA
(1) The role of Bluetooth in all scenarios except A2DP is slave.
(2) CL1P5 PA is connected to VBAT, 3.7 V.
(3) ACL RX has the same current in all modulations.
(4) Full throughput assumes data transfer in one direction.