SBOS061C February   1997  – October 2024 XTR105

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings #GUID-80F0CD5F-C345-42B2-B6A9-580512790460/R_DESCRIPTION_LI1
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics
    5. 5.5 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Linearization
        1. 6.3.1.1 High-Resistance RTDs
      2. 6.3.2 Voltage Regulator
      3. 6.3.3 Open-Circuit Protection
      4. 6.3.4 Reverse-Voltage Protection
      5. 6.3.5 Surge Protection
    4. 6.4 Device Functional Modes
  8. Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 External Transistor
      2. 7.1.2 Loop Power Supply
      3. 7.1.3 2-Wire and 3-Wire RTD Connections
      4. 7.1.4 Radio Frequency Interference
      5. 7.1.5 Error Analysis
    2. 7.2 Typical Applications
    3. 7.3 Layout
      1. 7.3.1 Layout Guidelines
  9. Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • N|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Layout Guidelines

The XTR105 is typically used with an external transistor (Q1) to regulate the power dissipation of the 4-20mA loop. This allows the resulting localized self-heating to be distanced from the precision circuitry of the XTR105 and reduces over-temperature drift errors.

The XTR105 can be used without the Q1 transistor if the application requirements do not lead to violation of the device Absolute Maximum Requirements, such as the maximum junction temperature. Calculate the peak power dissipation and multiply by thermal resistance to determine the associated junction temperature rise. Minimize overheat conditions for reliable long-term operation.

Place supply bypass capacitors close to the package and make connections with low-impedance conductors. Reduce trace lengths for RG to minimize coupled environmental noise. If the loop power supply is electrically noisy, implement filtering using decoupling capacitors and small resistors or dampening inductors in series with V+.