SBOS375D October   2006  – October 2024 XTR111

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configurations and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Explanation of Pin Functions
      2. 6.3.2 Dynamic Performance
      3. 6.3.3 External Current Limit
      4. 6.3.4 External MOSFET
      5. 6.3.5 Output Error Flag and Disable Input
      6. 6.3.6 Voltage Regulator
      7. 6.3.7 Level Shift of 0V Input and Transconductance Trim
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Input Voltage
      2. 7.1.2 Error Flag Delay
      3. 7.1.3 Voltage Output Configuration
      4. 7.1.4 4mA-to-20mA Output
    2. 7.2 Typical Applications
      1. 7.2.1 0mA–20mA Voltage-to-Current Converter
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
      2. 7.2.2 Additional Applications
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Package and Heat Dissipation
        2. 7.4.1.2 Thermal Pad Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DRC|10
  • DGQ|10
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3.5 Output Error Flag and Disable Input

The XTR111 has additional internal circuitry that detects an error in the output current. In case the controlled output current cannot flow as a result of a wire break, high load resistance, or the output voltage level approaching the positive supply, error flag EF (an open drain logic output), pulls low. When used, this digital output requires an external pullup resistor to logic high (the internal pullup resistor current is 2μA).

The output disable (OD) pin is a logic input with approximately 4μA of current through the internal pullup resistor to 5V. The XTR111 powers up with the output disabled until the OD pin is pulled low. A logic high disables the output to zero output current. This method can be used for calibration, power-on and power-off glitch reduction, and for output multiplexing with other outputs connected to the same pin.

Powering on while the output is disabled (OD = high) cannot fully suppress output glitching. While the supply voltage passes through the range of 3V to 4V, internal circuits turn on. Additional capacitance between the VG and IS pins can suppress the glitch. The smallest glitch energy appears with the OD pin left open; for practical use, however, this pin can be driven high through a 10kΩ resistor before the 24V supply is applied, if logic voltage is available earlier. Alternatively, an open-drain driver can control this pin using the internal pullup current. Pulling up to the internal regulator tends to increase the energy because of the delay of the regulator-voltage increase, again depending on the supply voltage rise time for the first few volts.