SLAS611C October   2009  – January 2016 ADS5400

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Interleaving Adjustments
    7. 6.7 Timing Requirements
    8. 6.8 Switching Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Input Configuration
      2. 7.3.2  Voltage Reference
      3. 7.3.3  Analog Input Over-Range Recovery Error
      4. 7.3.4  Clock Inputs
      5. 7.3.5  Over Range
      6. 7.3.6  Data Scramble
      7. 7.3.7  Test Patterns
      8. 7.3.8  Die Identification and Revision
      9. 7.3.9  Die Temperature Sensor
      10. 7.3.10 Interleaving
        1. 7.3.10.1 Gain Adjustment
        2. 7.3.10.2 Offset Adjustment
        3. 7.3.10.3 Input Clock Coarse Phase Adjustment
        4. 7.3.10.4 Input Clock Fine Phase Adjustment
    4. 7.4 Device Functional Modes
      1. 7.4.1 Output Bus and Clock Options
      2. 7.4.2 Reset and Synchronization
      3. 7.4.3 LVDS
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
    6. 7.6 Register Maps
      1. 7.6.1 Serial Register Map
      2. 7.6.2 Description of Serial Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Clocking Source for ADS5400
        2. 8.2.2.2 Amplifier Selection
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 PowerPAD™ Package
      1. 10.3.1 Assembly Process
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • 1-GSPS Sample Rate
  • 12-Bit Resolution
  • 2.1 GHz Input Bandwidth
  • SFDR = 66 dBc at 1.2 GHz
  • SNR = 57.6 dBFS at 1.2 GHz
  • 7 Clock Cycle Latency
  • Interleave Friendly: Internal Adjustments for Gain, Phase, and Offset
  • 1.5-V to 2-V Selectable Full-Scale Range
  • LVDS-Compatible Outputs, 1 or 2 Bus Options
  • Total Power Dissipation: 2.15 W
  • On-Chip Analog Buffer
  • 100-Pin HTQFP PowerPAD™ Package
    (16-mm × 16-mm Footprint With Leads)
  • Industrial Temperature Range of –40°C to 85°C

2 Applications

  • Test and Measurement Instrumentation
  • Ultra-Wide Band Software-Defined Radio
  • Data Acquisition
  • Power Amplifier Linearization
  • Signal Intelligence and Jamming
  • Radar

3 Description

The ADS5400 device is a 12-bit, 1-GSPS analog-to-digital converter (ADC) that operates from both a 5-V supply and 3.3-V supply, while providing LVDS-compatible digital outputs. The analog input buffer isolates the internal switching of the track and hold from disturbing the signal source. The simple 3-stage pipeline provides extremely low latency for time critical applications. Designed for the conversion of signals up to 2 GHz of input frequency at 1 GSPS, the ADS5400 has outstanding low noise performance and spurious-free dynamic range over a large input frequency range.

The ADS5400 is available in a HTQFP-100 PowerPAD™ package. The combination of the PowerPAD package and moderate power consumption of the ADS5400 allows for operation without an external heatsink. The ADS5400 is built on Texas Instrument's complementary bipolar process (BiCom3) and is specified over the full industrial temperature range (–40°C to 85°C).

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
ADS5400 HTQFP (100) 14.00 mm × 14.00 mm
  1. For all available packages, see the orderable addendum at the end of the datasheet.

Block Diagram

ADS5400 fbd_las611.gif