Refer to the PDF data sheet for device specific package drawings
AM3517/05 is a high-performance ARM Cortex-A8 microprocessor with speeds up to 600 MHz. The device offers 3D graphics acceleration while also supporting numerous peripherals, including DDR2, CAN, EMAC, and USB OTG PHY that are well suited for industrial apllications.
The processor can support other applications, including:
The device supports high-level operating systems (OSs), such as:
The following subsystems are part of the device:
AM3517/05 devices are available in a 491-pin BGA package and a 484-pin PBGA package.
This AM3517/05 data manual presents the electrical and mechanical specifications for the AM3517/05 Sitara processor.
Figure 1-1 shows the functional block diagram of the AM3517/05 Sitara ARM microprocessor.
This data manual revision history table highlights the technical and major format changes made from Revision E to Revision F.
SEE | ADDITIONS/MODIFICATIONS/DELETIONS |
---|---|
Description: | |
Added Device Information table | |
Section 3 | Device Comparison: |
Added Section 3, Device Comparison | |
Added Section 3.1, Device Features Comparison | |
Moved Section 3.2, ZCN and ZER Package Differences to Section 3, Device Comparison | |
Section 4 | Terminal Configuration and Functions: |
Changed title from Terminal Description to Terminal Configuration and Functions | |
Section 4.4.9 | Signal Description: |
Added pin N22 to VDDS row of the ZCN package in Table 4-27, Power Supplies Description. | |
Section 5 | Specifications: |
Changed title from Electrical Characteristics to Specifications | |
Extracted handling ratings from Table 5-1, Absolute Maximum Ratings Over Operating Junction Temperature Range and added Table 5-2, Handling Ratings | |
Moved Section 5.9, Clock Specifications to Section 5, Specifications | |
Moved Section 5.10, Video DAC Specifications toSection 5, Specifications | |
Section 5.4 | Power Consumption Summary: |
Moved Table 5-4, Estimated Power Consumption at Ball Level to its own section. | |
Section 5.5 | Electrical Characteristics: |
Changed title from DC Electrical Characteristics to Electrical Characteristics | |
Section 5.6 | Thermal Characteristics: |
Changed title from Package Thermal Resistance to Thermal Characteristics | |
Moved section from Package Characteristics to separate section | |
Added θJA, θJC, θJB values to tables (Table 5-6 and Table 5-7) for ZCN and ZER package thermal resistance characteristics. | |
Section 7 | Device and Documentation Support |
Changed title Package Characteristics to Device and Documentation Support | |
Changed title Device and Development Support - Support Tool Nomenclature to Section 7.1.2, Device Nomenclature | |
Added Section 7.1.1, Development Support | |
Changed title Related Documentation From Texas Instruments to Section 7.2.1, Related Documentation | |
Moved section Related Documentation to Section 7.2.1, Related Documentation | |
Section 8 | Mechanical Packaging and Orderable Information |
Changed title Mechanical Data to Mechanical Packaging and Orderable Information |
FEATURE | AM3505 | AM3517 |
---|---|---|
PowerVR SGX Graphics Accelerator | No | Yes |
Table 3-2 lists the ZER and ZCN package differences on the device.
FEATURE | ZCN PACKAGE | ZER PACKAGE |
---|---|---|
Pin Assignments | For ZCN package pin assignments, see Section 4, Terminal Configuration and Functions | For ZER package pin assignments, see Section 4, Terminal Configuration and Functions |
Video Interfaces | TV Out available | TV Out not available |