SLPS585 March   2016

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Powering bq500101 And Gate Drivers
      2. 7.3.2 Undervoltage Lockout Protection (UVLO)
      3. 7.3.3 Integrated Boost-Switch
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Application Curves
    3. 8.3 System Example
      1. 8.3.1 Power Loss Curves
      2. 8.3.2 Safe Operating Area (SOA) Curves
      3. 8.3.3 Normalized Curves
        1. 8.3.3.1 Calculating Power Loss and SOA
          1. 8.3.3.1.1 Design Example
          2. 8.3.3.1.2 Calculating Power Loss
          3. 8.3.3.1.3 Calculating SOA Adjustments
  9. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 Recommended PCB Design Overview
      2. 9.1.2 Electrical Performance
    2. 9.2 Layout Example
    3. 9.3 Thermal Considerations
  10. 10Device and Documentation Support
    1. 10.1 Trademarks
    2. 10.2 Electrostatic Discharge Caution
    3. 10.3 Glossary
  11. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Mechanical Drawing
    2. 11.2 Recommended PCB Land Pattern
    3. 11.3 Recommended Stencil Opening

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DPC|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • 98% System Efficiency at 5 A
  • Max Rated Continuous Current 10 A, Peak 15 A
  • High-Frequency Operation (up to 600 kHz)
  • High-Density SON 3.5 × 4.5 mm Footprint
  • Ultra-Low Inductance Package
  • System Optimized PCB Footprint
  • 3.3-V and 5-V PWM Signal Compatible
  • Input Voltages up to 24 V
  • Integrated Bootstrap Diode
  • Shoot-Through Protection
  • RoHS Compliant – Lead Free Terminal Plating
  • Halogen Free
  • Optimized Power Stage Containing High-Efficiency Gate Drivers and FETs
  • Optimized for 15-W Wireless Power Transmitter Designs

2 Applications

  • WPC (Qi) 1.2 Compliant Wireless Power Transmitters for 15-W or 5-W Systems
  • Proprietary Wireless Chargers and Transmitters
  • Wirelessly Powered Industrial and Medical Systems
  • For more information, see www.ti.com/wirelesspower

3 Description

The bq500101 NexFET™ Power Stage is optimized for wireless power applications covering the WPC v1.2 medium power specification. The device can be used for both the rail voltage control in fixed frequency transmitter types as well as the coil drivers for both fixed and variable frequency types. This combination produces a high-current, high-efficiency, and high-speed switching device in a small 3.5 × 4.5 mm outline package. In addition, the PCB footprint is optimized to help reduce design time and simplify the completion of the overall system design.

Device Information(1)

ORDER NUMBER PACKAGE BODY SIZE (NOM)
bq500101 DPC (9) 3.5 mm x 4.5 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

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Application Diagram

bq500101 bq500101_Apps_Diagram.gif

Typical Power Stage Efficiency and Power Loss

bq500101 D001_SLPS585.gif