SWRS037B January   2006  – March 2015 CC1150

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Terminal Configuration and Functions
    1. 3.1 Pin Attributes
  4. 4Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  General Characteristics
    5. 4.5  Current Consumption
    6. 4.6  RF Transmit
    7. 4.7  Crystal Oscillator
    8. 4.8  Frequency Synthesizer Characteristics
    9. 4.9  Analog Temperature Sensor
    10. 4.10 DC Characteristics
    11. 4.11 Power-On Reset
    12. 4.12 Thermal Resistance Characteristics for VQFNP Package
  5. 5Detailed Description
    1. 5.1  Overview
    2. 5.2  Functional Block Diagram
    3. 5.3  Configuration Overview
    4. 5.4  Configuration Software
    5. 5.5  4-wire Serial Configuration and Data Interface
      1. 5.5.1 Chip Status Byte
      2. 5.5.2 Register Access
      3. 5.5.3 SPI Read
      4. 5.5.4 Command Strobes
      5. 5.5.5 FIFO Access
      6. 5.5.6 PATABLE Access
    6. 5.6  Microcontroller Interface and Pin Configuration
      1. 5.6.1 Configuration Interface
      2. 5.6.2 General Control and Status Pins
      3. 5.6.3 Optional Radio Control Feature
    7. 5.7  Data Rate Programming
    8. 5.8  Packet Handling Hardware Support
      1. 5.8.1 Data Whitening
      2. 5.8.2 Packet Format
        1. 5.8.2.1 Arbitrary Length Field Configuration
      3. 5.8.3 Packet Handling in Transmit Mode
      4. 5.8.4 Packet Handling in Firmware
    9. 5.9  Modulation Formats
      1. 5.9.1 Frequency Shift Keying
      2. 5.9.2 Minimum Shift Keying
      3. 5.9.3 Amplitude Modulation
    10. 5.10 Forward Error Correction with Interleaving
      1. 5.10.1 Forward Error Correction (FEC)
      2. 5.10.2 Interleaving
    11. 5.11 Radio Control
      1. 5.11.1 Power On Start-up Sequence
        1. 5.11.1.1 Automatic POR
        2. 5.11.1.2 Manual Reset
      2. 5.11.2 Crystal Control
      3. 5.11.3 Voltage Regulator Control
      4. 5.11.4 Active Mode
      5. 5.11.5 Timing
    12. 5.12 Data FIFO
    13. 5.13 Frequency Programming
    14. 5.14 VCO
      1. 5.14.1 VCO and PLL Self-Calibration
    15. 5.15 Voltage Regulators
    16. 5.16 Output Power Programming
      1. 5.16.1 Shaping and PA Ramping
    17. 5.17 General Purpose and Test Output Control Pins
    18. 5.18 Asynchronous and Synchronous Serial Operation
      1. 5.18.1 Asynchronous Serial Operation
      2. 5.18.2 Synchronous Serial Operation
    19. 5.19 System Considerations and Guidelines
      1. 5.19.1 SRD Regulations
      2. 5.19.2 Frequency Hopping and Multi-Channel Systems
      3. 5.19.3 Wideband Modulation Not Using Spread Spectrum
      4. 5.19.4 Data Burst Transmissions
      5. 5.19.5 Continuous Transmissions
      6. 5.19.6 Low-Cost Systems
      7. 5.19.7 Battery-Operated Systems
      8. 5.19.8 Increasing Output Power
    20. 5.20 Memory
      1. 5.20.1 Configuration Register Details
      2. 5.20.2 Status Register Details
  6. 6Applications, Implementation, and Layout
    1. 6.1 Application Information
      1. 6.1.1 Typical Application
    2. 6.2 Design Requirements
      1. 6.2.1 Bias Resistor
      2. 6.2.2 Balun and RF Matching
      3. 6.2.3 Crystal
      4. 6.2.4 Reference Signal
      5. 6.2.5 Additional Filtering
      6. 6.2.6 Power Supply Decoupling
    3. 6.3 PCB Layout Recommendations
      1. 6.3.1 Package Description (QLP 16)
  7. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Device Nomenclature
    2. 7.2 Documentation Support
      1. 7.2.1 Community Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Export Control Notice
    6. 7.6 Glossary
  8. 8Mechanical Packaging and Orderable Information
    1. 8.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Device Overview

1.1 Features

  • Small Size
    • QLP 4-mm × 4-mm Package, 16 Pins
  • True Single Chip UHF RF Transmitter
  • Frequency Bands
    • 300 to 348 MHz
    • 400 to 464 MHz
    • 800 to 928 MHz
  • Programmable Data Rate Up to 500 kBaud
  • Low Current Consumption
  • Programmable Output Power Up to +10 dBm for All Supported Frequencies
  • Programmable Baseband Modulator
  • Ideal For Multi-channel Operation
  • Very Few External Components
    • Completely On-chip Frequency Synthesizer
    • No External Filters Needed
  • Configurable Packet Handling Hardware
  • Suitable for Frequency Hopping Systems Due to a Fast Settling Frequency Synthesizer
  • Optional Forward Error Correction with Interleaving
  • 64-byte TX Data FIFO
  • Suited for Systems Compliant with EN 300 220 and FCC CFR Part 15
  • Many Powerful Digital Features Allow a High-performance RF system to be made Using an Inexpensive Microcontroller
  • Efficient SPI interface: All Registers Can be Programmed With One "Burst" Transfer
  • Integrated Analog Temperature Sensor
  • Lead-free “Green” Package
  • Flexible Support for Packet Oriented Systems
    • On-chip Support for Sync-Word Insertion, Flexible Packet Length and Automatic CRC Handling
  • OOK and Flexible ASK Shaping Supported
  • 2-FSK, GFSK and MSK Supported
  • Optional Automatic Whitening of Data
  • Support for Asynchronous Transparent Transmit Mode for Backwards Compatibility with Existing Radio Communication Protocols

1.2 Applications

  • Ultra-low Power UHF Wireless Transmitters
  • Operating in the 315-, 433-, 868-, and 915-MHz ISM/SRD bands
  • AMR – Automatic Meter Reading
  • Consumer Electronics
  • RKE – Remote Keyless Entry
  • Low Power Telemetry
  • Home and Building Automation
  • Wireless Alarm and Security Systems
  • Industrial Monitoring and Control
  • Wireless Sensor Networks

1.3 Description

The CC1150 is a true single-chip UHF transmitter designed for very low power wireless applications. The circuit is mainly intended for the ISM (Industrial, Scientific and Medical) and SRD (Short Range Device) frequency bands at 315-, 433-, 868-, and 915-MHz, but can easily be programmed for operation at other frequencies in the 300 to 348 MHz, 400 to 464 MHz and 800 to 928 MHz bands.

The RF transmitter is integrated with a highly configurable baseband modulator. The modulator supports various modulation formats and has a configurable data rate up to 500 kBaud. The CC1150 device provides extensive hardware support for packet handling, data buffering and burst transmissions.

The main operating parameters and the 64-byte transmit FIFO of CC1150 can be controlled via an SPI interface. In a typical system, the CC1150 device will be used together with a microcontroller and a few additional passive components.

CC1150 is part of the SmartRF™ technology platform based on 0.18-μm CMOS technology from Texas Instruments.

Table 1-1 Device Information(1)

PART NUMBER PACKAGE BODY SIZE
CC1150 VQFNP (16) 4.00 mm × 4.00 mm
(1) For more information, see Section 8, Mechanical Packaging and Orderable Information.

1.4 Functional Block Diagram

CC1150 cc1150_sbd_swrs037.gif