Data Sheet
TPS62088 和 TPS6208xA 采用 1.2mm x 0.8mm Wafer Chip Scale Package 封装且适用于嵌入式应用的 2.4V 至 5.5V 输入、微型 6 引脚 2A/3A 降压转换器
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1 特性
- DCS-Control 拓扑
- 效率高达 95%
- 26mΩ 和 26mΩ 内部功率 MOSFET
- 输入电压范围为 2.4V 至 5.5V
- 运行静态电流 4μA
- 1% 的输出电压精度
- 4MHz 开关频率
- 可实现轻负载效率的省电模式
- 强制 PWM 版本可支持 CCM 运行
- 100% 占空比，可实现超低压降
- 有源输出放电
- 电源正常状态输出
- 热关断保护
- 断续短路保护
- 采用间距为 0.4mm 的 6 引脚 WCSP 和 PowerWCSP 封装
- 0.3mm 高的 YWC 封装支持嵌入式系统
- 支持 12mm2 的设计尺寸
- 支持高度小于 0.6mm 的设计
- 使用 TPS62088 并借助 WEBENCH® Power Designer 创建定制设计方案
3 说明
TPS6208xx 器件系列是一种高频同步降压转换器，旨在实现小设计尺寸和高效率。该器件的输入电压范围为 2.4V 至 5.5V，支持常用电池技术。该转换器在中高负载条件下以 PWM 模式运行，并在轻负载时自动进入省电模式运行，从而在整个负载电流范围内保持高效率。器件的强制 PWM 版本可在任意负载上维持 CCM 运行。4MHz 的开关频率允许该器件使用小型外部元件。该器件可同时实现 DCS-Control 架构、出色的负载瞬态性能和输出稳压精度。内置的其他特性包括过流保护、热关断保护、有源输出放电和电源正常。该器件采用 6 引脚 WCSP 封装。
器件信息
| 器件型号(2) | 封装(1) | 本体尺寸（标称值） |
|---|---|---|
| TPS62088 | YFP（DSBGA，6） | 0.8mm × 1.2mm × 0.5mm |
| TPS62089A | ||
| TPS62088A | YWC（DSBGA，6） | 0.8mm × 1.2mm × 0.3mm |
(1) 有关更多信息，请参阅节 11。
(2) 请参阅器件选项 表。
典型应用原理图
输入电压为 3.3V 时的效率4 Device Options
| PART NUMBER(1) | OPERATION MODE | OUTPUT VOLTAGE |
|---|---|---|
| TPS62088YFP | PFM/PWM | 3-A adjustable |
| TPS62088YWC | PFM/PWM | 3-A adjustable |
| TPS6208812YFP | PFM/PWM | 3 A with 1.2 V |
| TPS6208818YFP | PFM/PWM | 3 A with 1.8 V |
| TPS6208833YFP | PFM/PWM | 3 A with 3.3 V |
| TPS62088AYFP | Forced-PWM | 3-A adjustable |
| TPS62089AYFP | Forced-PWM | 2-A adjustable |
(1) For detailed ordering
information, please check the package option addendum section at the end of this
data sheet.
5 Pin Configuration and Functions
Figure 5-1 6-Pin YFP Package, DSBGA(Top View)
Figure 5-2 6-Pin YWC Package, DSBGA(Top View)Table 5-1 Pin Functions
| PIN | TYPE(1) | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| EN | A1 | I | Device enable pin. To enable the device, this pin needs to be pulled high. Pulling this pin low disables the device. Do not leave floating. |
| PG | B1 | O | Power-good open-drain output pin. The pullup resistor can be connected to voltages up to 5.5 V. If unused, leave this pin floating. |
| FB | C1 | I | Feedback pin. For the fixed output voltage versions, this pin must be connected to the output. |
| GND | C2 | — | Ground pin |
| SW | B2 | O | Switch pin of the power stage |
| VIN | A2 | I | Input voltage pin |
(1) I = input, O = output
6 Specifications
6.1 Absolute Maximum Ratings
| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| Voltage at pins (2) | VIN, FB, EN, PG | –0.3 | 6 | V |
| SW (DC) | –0.3 | VIN + 0.3 | ||
| SW (DC, in current limit) | –1.0 | VIN + 0.3 | ||
| SW (AC, less than 10 ns) (3) | –2.5 | 10 | ||
| Temperature | Operating junction temperature, TJ | –40 | 150 | °C |
| Storage temperature, Tstg | –65 | 150 | ||
(2) All voltage values are with respect to network ground terminal.
(3) While switching.
6.2 ESD Ratings
| VALUE | UNIT | |||
|---|---|---|---|---|
| V(ESD) | Electrostatic discharge | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) | ±2000 | V |
| Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) | ±500 | V | ||
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
Over operating junction temperature range (unless otherwise noted)
| MIN | NOM | MAX | UNIT | ||
|---|---|---|---|---|---|
| VIN | Input voltage range | 2.4 | 5.5 | V | |
| VOUT | Output voltage range | 0.6 | 4.0 | V | |
| IOUT | Output current range, TPS62089A | 0 | 2 | A | |
| IOUT | Output current range, TPS62088, TPS62088A (1) | 0 | 3 | A | |
| ISINK_PG | Sink current at the PG pin | 1 | mA | ||
| VPG | Pullup resistor voltage | 5.5 | V | ||
| TJ | Operating junction temperature | -40 | 125 | °C | |
(1) For YFP package versions, lifetime is reduced when operating
continuously at 3-A output current with the junction temperature higher than 85°C.
6.4 Thermal Information
| THERMAL METRIC(1) | TPS62088/TPS6208xA | UNIT | ||||
|---|---|---|---|---|---|---|
| 6 PINS | ||||||
| YFP (6 PINS) | YWC (6 PINS) | YFP EVM-814 | YWC EVM-084 | |||
| RθJA | Junction-to-ambient thermal resistance | 141.3 | 130.9 | 85.7 | 70.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 1.7 | 1.1 | n/a (2) | n/a (2) | °C/W |
| RθJB | Junction-to-board thermal resistance | 47.3 | 27.3 | n/a (2) | n/a (2) | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.5 | 0.7 | 1.9 | 0.5 | °C/W |
| ψJB | Junction-to-board characterization parameter | 47.5 | 27.2 | 55.9 | 38.7 | °C/W |
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) Not applicable to an EVM.
