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  • CC23xx SimpleLink Wireless Microcontroller Unit

    • SWCU193A April   2023  – August 2024 CC2340R2 , CC2340R5 , CC2340R5-Q1

       

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  • CC23xx SimpleLink Wireless Microcontroller Unit
  1.   1
  2.   Read This First
    1.     About This Manual
    2.     Devices
    3.     Register, Field, and Bit Calls
    4.     Related Documentation
    5.     Trademarks
  3. 1 Architectural Overview
    1. 1.1  Target Applications
    2. 1.2  Introduction
    3. 1.3  Arm Cortex M0+
      1. 1.3.1 Processor Core
      2. 1.3.2 SysTick Timer
      3. 1.3.3 Nested Vectored Interrupt Controller
      4. 1.3.4 System Control Block (SCB)
    4. 1.4  On-Chip Memory
      1. 1.4.1 SRAM
      2. 1.4.2 Flash
      3. 1.4.3 ROM
    5. 1.5  Power Supply System
      1. 1.5.1 VDDS
      2. 1.5.2 VDDR
      3. 1.5.3 VDDD Digital Core Supply
      4. 1.5.4 DC/DC Converter
    6. 1.6  Radio
    7. 1.7  AES 128-bit Cryptographic Accelerator
    8. 1.8  System Timer (SYSTIM)
    9. 1.9  General Purpose Timers (LGPT)
    10. 1.10 Always-ON (AON) or Ultra-Low Leakage (ULL) Domain
      1. 1.10.1 Watchdog Timer
      2. 1.10.2 Battery and Temperature Monitor
      3. 1.10.3 Real-time Clock (RTC)
      4. 1.10.4 Low Power Comparator
    11. 1.11 Direct Memory Access
    12. 1.12 System Control and Clock
    13. 1.13 Communication Peripherals
      1. 1.13.1 UART
      2. 1.13.2 I2C
      3. 1.13.3 SPI
    14. 1.14 Programmable I/Os
    15. 1.15 Serial Wire Debug (SWD)
  4. 2  Arm Cortex-M0+ Processor
    1. 2.1 Introduction
    2. 2.2 Block Diagram
    3. 2.3 Overview
      1. 2.3.1 Peripherals
      2. 2.3.2 Programmer's Model
      3. 2.3.3 Instruction Set Summary
      4. 2.3.4 Memory Model
    4. 2.4 Registers
      1. 2.4.1 BPU Registers
      2. 2.4.2 CPU_ROM_TABLE Registers
      3. 2.4.3 DCB Registers
      4. 2.4.4 SCB Registers
      5. 2.4.5 SCSCS Registers
      6. 2.4.6 NVIC Registers
      7. 2.4.7 SYSTICK Registers
  5. 3 Memory Map
    1. 3.1 Memory Map
  6. 4 Interrupts and Events
    1. 4.1 Exception Model
      1. 4.1.1 Exception States
      2. 4.1.2 Exception Types
      3. 4.1.3 Exception Handlers
      4. 4.1.4 Vector Table
      5. 4.1.5 Exception Priorities
      6. 4.1.6 Exception Entry and Return
        1. 4.1.6.1 Exception Entry
        2. 4.1.6.2 Exception Return
    2. 4.2 Fault Handling
      1. 4.2.1 Lockup
    3. 4.3 Event Fabric
      1. 4.3.1 Introduction
      2. 4.3.2 Overview
      3. 4.3.3 Registers
      4. 4.3.4 AON Event Fabric
        1. 4.3.4.1 AON Common Input Events List
        2. 4.3.4.2 AON Event Subscribers
        3. 4.3.4.3 Power Management Controller (PMCTL)
        4. 4.3.4.4 Real Time Clock (RTC)
        5. 4.3.4.5 AON to MCU Event Fabric
      5. 4.3.5 MCU Event Fabric
        1. 4.3.5.1 Common Input Event List
        2. 4.3.5.2 MCU Event Subscribers
          1. 4.3.5.2.1 System CPU
          2. 4.3.5.2.2 Non-Maskable Interrupt (NMI)
    4. 4.4 Digital Test Bus (DTB)
    5. 4.5 EVTULL Registers
    6. 4.6 EVTSVT Registers
  7. 5 Debug Subsystem
    1. 5.1  Introduction
    2. 5.2  Block Diagram
    3. 5.3  Overview
      1. 5.3.1 Physical Interface
      2. 5.3.2 Debug Access Ports
    4. 5.4  Debug Features
      1. 5.4.1 Processor Debug
      2. 5.4.2 Breakpoint Unit (BPU)
      3. 5.4.3 Peripheral Debug
    5. 5.5  Behavior in Low Power Modes
    6. 5.6  Restricting Debug Access
    7. 5.7  Mailbox (DSSM)
    8. 5.8  Mailbox Events
      1. 5.8.1 CPU Interrupt Event (AON_DBG_COMB)
    9. 5.9  Software Considerations
    10. 5.10 DBGSS Registers
  8. 6 Power, Reset, and Clocking
    1. 6.1  Introduction
    2. 6.2  System CPU Modes
    3. 6.3  Supply System
      1. 6.3.1 Internal DC/DC Converter and Global LDO
    4. 6.4  Power States
      1. 6.4.1 Reset
      2. 6.4.2 Shutdown
      3. 6.4.3 Active
      4. 6.4.4 Idle
      5. 6.4.5 Standby
    5. 6.5  Digital Power Partitioning
    6. 6.6  Clocks
      1. 6.6.1 CLKSVT
      2. 6.6.2 CLKULL
    7. 6.7  Resets
      1. 6.7.1 Watchdog Timer (WDT)
      2. 6.7.2 LF Loss Detection
    8. 6.8  AON (REG3V3) Register Bank
    9. 6.9  CKMD Registers
    10. 6.10 CLKCTL Registers
    11. 6.11 PMCTL Registers
  9. 7 Internal Memory
    1. 7.1 SRAM
    2. 7.2 VIMS
      1. 7.2.1 Introduction
      2. 7.2.2 Block Diagram
      3. 7.2.3 Cache
        1. 7.2.3.1 Basic Cache Mechanism
        2. 7.2.3.2 Cache Prefetch Mechanism
        3. 7.2.3.3 Cache Micro-Prediction Mechanism
      4. 7.2.4 Flash
        1. 7.2.4.1 Flash Read-Only Protection
        2. 7.2.4.2 Flash Memory Programming
      5. 7.2.5 ROM
    3. 7.3 VIMS Registers
    4. 7.4 FLASH Registers
  10. 8 Device Boot and Bootloader
    1. 8.1 Device Boot and Programming
      1. 8.1.1 Boot Flow
      2. 8.1.2 Boot Timing
      3. 8.1.3 Boot Status
      4. 8.1.4 Boot Protection/Locking Mechanisms
      5. 8.1.5 Debug and Active SWD Connections at Boot
      6. 8.1.6 Flashless Test Mode and Tools Client Mode
        1. 8.1.6.1 Flashless Test Mode
        2. 8.1.6.2 Tools Client Mode
      7. 8.1.7 Retest Mode and Return-to-Factory Procedure
      8. 8.1.8 Disabling SWD Debug Port
    2. 8.2 Flash Programming
      1. 8.2.1 CCFG
      2. 8.2.2 CCFG Permissions/Restrictions that Affect Flash Programming
      3. 8.2.3 SACI Flash Programming Commands
      4. 8.2.4 Flash Programming Flows
        1. 8.2.4.1 Initial Programming of a New Device
        2. 8.2.4.2 Reprogramming of Previously Programmed Device
        3. 8.2.4.3 Add User Record on Already Programmed Device as Part of Commissioning Step
        4. 8.2.4.4 Incrementally Program Ancillary Data to MAIN Flash Sectors of a Previously Programmed Device
        5. 8.2.4.5 Debug Flow Charts
    3. 8.3 Device Management Command Interface
      1. 8.3.1 SACI Communication Protocol
        1. 8.3.1.1 Host Side Protocol
        2. 8.3.1.2 Command Format
        3. 8.3.1.3 Response Format
        4. 8.3.1.4 Response Result Field
        5. 8.3.1.5 Command Sequence Tag
        6. 8.3.1.6 Host Side Timeout
      2. 8.3.2 SACI Commands
        1. 8.3.2.1 Miscellaneous Commands
          1. 8.3.2.1.1 SACI_CMD_MISC_NO_OPERATION
          2. 8.3.2.1.2 SACI_CMD_MISC_GET_DIE_ID
          3. 8.3.2.1.3 SACI_CMD_MISC_GET_CCFG_USER_REC
        2. 8.3.2.2 Debug Commands
          1. 8.3.2.2.1 SACI_CMD_DEBUG_REQ_PWD_ID
          2. 8.3.2.2.2 SACI_CMD_DEBUG_SUBMIT_AUTH
          3. 8.3.2.2.3 SACI_CMD_DEBUG_EXIT_SACI_HALT
          4. 8.3.2.2.4 SACI_CMD_DEBUG_EXIT_SACI_SHUTDOWN
          5. 8.3.2.2.5 SACI_CMD_BLDR_APP_RESET_DEVICE
          6. 8.3.2.2.6 SACI_CMD_BLDR_APP_EXIT_SACI_RUN
        3. 8.3.2.3 Flash Programming Commands
          1. 8.3.2.3.1 SACI_CMD_FLASH_ERASE_CHIP
          2. 8.3.2.3.2 SACI_CMD_FLASH_PROG_CCFG_SECTOR
          3. 8.3.2.3.3 SACI_CMD_FLASH_PROG_CCFG_USER_REC
          4. 8.3.2.3.4 SACI_CMD_FLASH_PROG_MAIN_SECTOR
          5. 8.3.2.3.5 SACI_CMD_FLASH_PROG_MAIN_PIPELINED
          6. 8.3.2.3.6 SACI_CMD_FLASH_VERIFY_MAIN_SECTORS
          7. 8.3.2.3.7 SACI_CMD_FLASH_VERIFY_CCFG_SECTOR
    4. 8.4 Bootloader Support
      1. 8.4.1 Bootloader Parameters
      2. 8.4.2 Persistent State
      3. 8.4.3 User-Defined Bootloader Guidelines
    5. 8.5 ROM Serial Bootloader
      1. 8.5.1 ROM Serial Bootloader Interfaces
        1. 8.5.1.1 Packet Handling
          1. 8.5.1.1.1 Packet Acknowledge and Not-Acknowledge Bytes
        2. 8.5.1.2 Transport Layer
          1. 8.5.1.2.1 UART Transport
            1. 8.5.1.2.1.1 UART Baud Rate Automatic Detection
          2. 8.5.1.2.2 SPI Transport
      2. 8.5.2 ROM Serial Bootloader Parameters
      3. 8.5.3 ROM Serial Bootloader Commands
        1. 8.5.3.1 BLDR_CMD_PING
        2. 8.5.3.2 BLDR_CMD_GET_STATUS
        3. 8.5.3.3 BLDR_CMD_GET_PART_ID
        4. 8.5.3.4 BLDR_CMD_RESET
        5. 8.5.3.5 BLDR_CMD_CHIP_ERASE
        6. 8.5.3.6 BLDR_CMD_CRC32
        7. 8.5.3.7 BLDR_CMD_DOWNLOAD
        8. 8.5.3.8 BLDR_CMD_DOWNLOAD_CRC
        9. 8.5.3.9 BLDR_CMD_SEND_DATA
      4. 8.5.4 Bootloader Firmware Update Example
  11. 9 Device Configuration
    1. 9.1 Factory Configuration (FCFG)
    2. 9.2 Customer Configuration (CCFG)
  12. 10General Purpose Timers (LGPT)
    1. 10.1 Overview
    2. 10.2 Block Diagram
    3. 10.3 Functional Description
      1. 10.3.1  Prescaler
      2. 10.3.2  Counter
      3. 10.3.3  Target
      4. 10.3.4  Channel Input Logic
      5. 10.3.5  Channel Output Logic
      6. 10.3.6  Channel Actions
        1. 10.3.6.1 Period and Pulse Width Measurement
        2. 10.3.6.2 Clear on Zero, Toggle on Compare Repeatedly
        3. 10.3.6.3 Set on Zero, Toggle on Compare Repeatedly
      7. 10.3.7  Channel Capture Configuration
      8. 10.3.8  Channel Filters
        1. 10.3.8.1 Setting up the Channel Filters
      9. 10.3.9  Synchronize Multiple LGPT Timers
      10. 10.3.10 Interrupts, ADC Trigger, and DMA Request
    4. 10.4 Timer Modes
      1. 10.4.1 Quadrature Decoder
      2. 10.4.2 DMA
      3. 10.4.3 IR Generation
      4. 10.4.4 Fault and Park
      5. 10.4.5 Deadband
      6. 10.4.6 Deadband, Fault, and Park
      7. 10.4.7 Example Application: Brushless DC (BLDC) Motor
    5. 10.5 LGPT0 Registers
    6. 10.6 LGPT1 Registers
    7. 10.7 LGPT2 Registers
    8. 10.8 LGPT3 Registers
  13. 11System Timer (SYSTIM)
    1. 11.1 Overview
    2. 11.2 Block Diagram
    3. 11.3 Functional Description
      1. 11.3.1 Common Channel Features
        1. 11.3.1.1 Compare Mode
        2. 11.3.1.2 Capture Mode
        3. 11.3.1.3 Additional Channel Arming Methods
      2. 11.3.2 Interrupts and Events
    4. 11.4 SYSTIM Registers
  14. 12Real Time Clock (RTC)
    1. 12.1 Introduction
    2. 12.2 Block Diagram
    3. 12.3 Interrupts and Events
      1. 12.3.1 Input Event
      2. 12.3.2 Output Event
      3. 12.3.3 Arming and Disarming Channels
    4. 12.4 Capture and Compare Configuration
      1. 12.4.1 Capture
      2. 12.4.2 Compare
    5. 12.5 RTC Registers
  15. 13Low Power Comparator and SYS0
    1. 13.1 Introduction
    2. 13.2 Block Diagram
    3. 13.3 Functional Description
      1. 13.3.1 Input Selection
      2. 13.3.2 Voltage Divider
      3. 13.3.3 Hysteresis
      4. 13.3.4 Wake-Up
    4. 13.4 SYS0 Registers
  16. 14Battery Monitor, Temperature Sensor, and DCDC Controller (PMUD)
    1. 14.1 Introduction
    2. 14.2 Functional Description
      1. 14.2.1 BATMON
      2. 14.2.2 DCDC
    3. 14.3 PMUD Registers
  17. 15Micro Direct Memory Access (µDMA)
    1. 15.1 Introduction
    2. 15.2 Block Diagram
    3. 15.3 Functional Description
      1. 15.3.1  Channel Assignments
      2. 15.3.2  Priority
      3. 15.3.3  Arbitration Size
      4. 15.3.4  Request Types
        1. 15.3.4.1 Single Request
        2. 15.3.4.2 Burst Request
      5. 15.3.5  Channel Configuration
      6. 15.3.6  Transfer Modes
        1. 15.3.6.1 Stop Mode
        2. 15.3.6.2 Basic Mode
        3. 15.3.6.3 Auto Mode
        4. 15.3.6.4 Ping-Pong Mode
        5. 15.3.6.5 Memory Scatter-Gather Mode
        6. 15.3.6.6 Peripheral Scatter-Gather Mode
      7. 15.3.7  Transfer Size and Increments
      8. 15.3.8  Peripheral Interface
      9. 15.3.9  Software Request
      10. 15.3.10 Interrupts and Errors
      11. 15.3.11 Initialization and Configuration
        1. 15.3.11.1 Module Initialization
        2. 15.3.11.2 Configuring a Memory-to-Memory Transfer
        3. 15.3.11.3 Configure the Channel Attributes
        4. 15.3.11.4 Configure the Channel Control Structure
        5. 15.3.11.5 Start the Transfer
        6. 15.3.11.6 Software Considerations
    4. 15.4 DMA Registers
  18. 16Advanced Encryption Standard (AES)
    1. 16.1 Introduction
      1. 16.1.1 AES Performance
    2. 16.2 Functional Description
      1. 16.2.1 Reset Considerations
      2. 16.2.2 Interrupt and Event Support
        1. 16.2.2.1 Interrupt Events and Requests
        2. 16.2.2.2 Connection to Event Fabric
      3. 16.2.3 µDMA
        1. 16.2.3.1 µDMA Example
    3. 16.3 Encryption and Decryption Configuration
      1. 16.3.1  CBC-MAC (Cipher Block Chaining-Message Authentication Code)
      2. 16.3.2  CBC (Cipher Block Chaining) Encryption
      3. 16.3.3  CBC Decryption
      4. 16.3.4  CTR (Counter) Encryption/Decryption
      5. 16.3.5  ECB (Electronic Code Book) Encryption
      6. 16.3.6  ECB Decryption
      7. 16.3.7  CFB (Cipher Feedback) Encryption
      8. 16.3.8  CFB Decryption
      9. 16.3.9  OFB (Open Feedback) Encryption
      10. 16.3.10 OFB Decryption
      11. 16.3.11 PCBC (Propagating Cipher Block Chaining) Encryption
      12. 16.3.12 PCBC Decryption
      13. 16.3.13 CTR-DRBG (Counter-Deterministic Random Bit Generator)
      14. 16.3.14 CCM
    4. 16.4 AES Registers
  19. 17Analog to Digital Converter (ADC)
    1. 17.1 Overview
    2. 17.2 Block Diagram
    3. 17.3 Functional Description
      1. 17.3.1  ADC Core
      2. 17.3.2  Voltage Reference Options
      3. 17.3.3  Resolution Modes
      4. 17.3.4  ADC Clocking
      5. 17.3.5  Power-Down Behavior
      6. 17.3.6  Sampling Trigger Sources and Sampling Modes
        1. 17.3.6.1 AUTO Sampling Mode
        2. 17.3.6.2 MANUAL Sampling Mode
      7. 17.3.7  Sampling Period
      8. 17.3.8  Conversion Modes
      9. 17.3.9  ADC Data Format
      10. 17.3.10 Status Register
      11. 17.3.11 ADC Events
        1. 17.3.11.1 CPU Interrupt Event Publisher (INT_EVENT0)
        2. 17.3.11.2 Generic Event Publisher (INT_EVENT1)
        3. 17.3.11.3 DMA Trigger Event Publisher (INT_EVENT2)
        4. 17.3.11.4 Generic Event Subscriber
    4. 17.4 Advanced Features
      1. 17.4.1 Window Comparator
      2. 17.4.2 DMA and FIFO Operation
        1. 17.4.2.1 DMA/CPU Operation in Non-FIFO Mode (FIFOEN=0)
        2. 17.4.2.2 DMA/CPU Operation in FIFO Mode (FIFOEN=1)
        3. 17.4.2.3 DMA/CPU Operation Summary Matrix
      3. 17.4.3 Ad-Hoc Single Conversion
    5. 17.5 ADC Registers
  20. 18I/O Controller (IOC)
    1. 18.1  Introduction
    2. 18.2  Block Diagram
    3. 18.3  I/O Mapping and Configuration
      1. 18.3.1 Basic I/O Mapping
      2. 18.3.2 Radio GPO
      3. 18.3.3 Pin Mapping
      4. 18.3.4 DTB Muxing
    4. 18.4  Edge Detection
    5. 18.5  GPIO
    6. 18.6  I/O Pins
    7. 18.7  Unused Pins
    8. 18.8  Debug Configuration
    9. 18.9  IOC Registers
    10. 18.10 GPIO Registers
  21. 19Universal Asynchronous Receiver/Transmitter (UART)
    1. 19.1 Introduction
    2. 19.2 Block Diagram
    3. 19.3 Functional Description
      1. 19.3.1 Transmit and Receive Logic
      2. 19.3.2 Baud Rate Generation
      3. 19.3.3 FIFO Operation
        1. 19.3.3.1 FIFO Remapping
      4. 19.3.4 Data Transmission
      5. 19.3.5 Flow Control
      6. 19.3.6 IrDA Encoding and Decoding
      7. 19.3.7 Interrupts
      8. 19.3.8 Loopback Operation
    4. 19.4 Interface to µDMA
    5. 19.5 Initialization and Configuration
    6. 19.6 UART Registers
  22. 20Serial Peripheral Interface (SPI)
    1. 20.1 Overview
      1. 20.1.1 Features
      2. 20.1.2 Block Diagram
    2. 20.2 Signal Description
    3. 20.3 Functional Description
      1. 20.3.1  Clock Control
      2. 20.3.2  FIFO Operation
        1. 20.3.2.1 Transmit FIFO
        2. 20.3.2.2 Repeated Transmit Operation
        3. 20.3.2.3 Receive FIFO
        4. 20.3.2.4 FIFO Flush
      3. 20.3.3  Interrupts
      4. 20.3.4  Data Format
      5. 20.3.5  Delayed Data Sampling
      6. 20.3.6  Chip Select Control
      7. 20.3.7  Command Data Control
      8. 20.3.8  Protocol Descriptions
        1. 20.3.8.1 Motorola SPI Frame Format
        2. 20.3.8.2 Texas Instruments Synchronous Serial Frame Format
        3. 20.3.8.3 MICROWIRE Frame Format
      9. 20.3.9  CRC Configuration
      10. 20.3.10 Auto CRC Functionality
      11. 20.3.11 Auto Header Functionality
      12. 20.3.12 SPI Status
      13. 20.3.13 Debug Halt
    4. 20.4 µDMA Operation
    5. 20.5 Initialization and Configuration
    6. 20.6 SPI Registers
  23. 21Inter-Integrated Circuit (I2C)
    1. 21.1 Introduction
    2. 21.2 Block Diagram
    3. 21.3 Functional Description
      1. 21.3.1 Functional Overview
        1. 21.3.1.1 Start and Stop Conditions
        2. 21.3.1.2 Data Format with 7-Bit Address
        3. 21.3.1.3 Data Validity
        4. 21.3.1.4 Acknowledge
        5. 21.3.1.5 Arbitration
      2. 21.3.2 Available Speed Modes
      3. 21.3.3 Interrupts
        1. 21.3.3.1 I2C Controller Interrupts
        2. 21.3.3.2 I2C Target Interrupts
      4. 21.3.4 Loopback Operation
      5. 21.3.5 Command Sequence Flow Charts
        1. 21.3.5.1 I2C Controller Command Sequences
        2. 21.3.5.2 I2C Target Command Sequences
    4. 21.4 Initialization and Configuration
    5. 21.5 I2C Registers
  24. 22Radio
    1. 22.1 Introduction
    2. 22.2 Block Diagram
    3. 22.3 Overview
      1. 22.3.1 Radio Sub-Domains
      2. 22.3.2 Radio RAMs
      3. 22.3.3 Doorbell (DBELL)
        1. 22.3.3.1 Interrupts
        2. 22.3.3.2 GPIO Control
        3. 22.3.3.3 SYSTIM Interface
    4. 22.4 Radio Usage Model
      1. 22.4.1 CRC and Whitening
    5. 22.5 LRFDDBELL Registers
    6. 22.6 LRFDRXF Registers
    7. 22.7 LRFDTXF Registers
  25. 23Revision History
  26. IMPORTANT NOTICE
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Technical Reference Manual

CC23xx SimpleLink Wireless Microcontroller Unit

Read This First

About This Manual

This document is organized into sections that correspond to each major feature; it explains the features and functionality of each module, and it also explains how to use them. For each feature, references are given to the documentation for the driver of the corresponding operating systems. This document does not contain performance characteristics of the device or modules, which are gathered in the corresponding device data sheets. This manual is intended for system software developers, hardware designers, and application developers.

Note: TI is transitioning to use more inclusive terminology. Some language may be different than what you would expect to see for certain technology areas.

 

Devices

The CC23xx device platform features different memory sizes, peripherals, and package options. All devices are centered around an Arm®Cortex®-M0+ series processor that handles the application layer and protocol stack.

Register, Field, and Bit Calls

The naming convention applied for a call consists of:

  • For a register call: <Module name>.<Register name>; for example: UART.UASR
  • For a bit field call:
    • <Module name>.<Register name>[End:Start] <Field name> field; for example, UART.UASR[4:0] SPEED bit field
    • <Field name> field <Module name>.<Register name>[End:Start]; for example, SPEED bit field UART.UASR[4:0]
  • For a bit call:
    • <Module name>.<Register name>[pos] <Bit name> bit; for example, UART.UASR[5] BIT_BY_CHAR bit
    • <Bit name> bit <Module name>.<Register name>[pos]; for example, BIT_BY_CHAR bit UART.UASR[5]

Related Documentation

The following related documents are available on the CC23xx device product pages at www.ti.com:

  1. CC2340R5:
    • CC2340R5 data sheet and errata (Technical Documents)
Note:

This list of documents was current as of publication date. Check the website for additional documentation, application notes, and white papers.

Additional, related documentation follows:

  1. The Institute of Electrical and Electronic Engineers, Inc., IEEE Standard Test Access Port and Boundary Scan Architecture, IEEE Std 1149.1a 1993 and Supplement Std. 1149.1b 1994 (see IEEExplore.ieee.org)
  2. The Institute of Electrical and Electronic Engineers, Inc., IEEE 1149.7 Standard for Reduced-Pin and Enhanced-Functionality Test Access Port and Boundary-Scan Architecture (see IEEExplore.ieee.org)
  3. National Institute of Standards and Technology, NIST Special Publication 800-38A, Recommendation for Block Cipher Modes of Operation Methods and Techniques (see NIST.gov)
  4. National Institute of Standards and Technology, NIST Special Publication 800-38D, Recommendation for Block Cipher Modes of Operation: Galois/Counter Mode (GCM) and GMAC (see NIST.gov)
  5. National Institute of Standards and Technology, FIPS 197, Advanced Encryption Standard (AES) (see NIST.gov)
  6. Bluetooth SIG, Inc., Bluetooth Specification versions 4.0, 4.1, 4.2, and 5.3 (see Bluetooth.com)

  7. Cortex-M0+ Devices Generic User Guide (see documentation at Arm.com)

  8. Cortex-M0+ Technical Reference Manual (see documentation at Arm.com)

  9. Arm®v6-M Architecture Reference Manual (see documentation at Arm.com)
  10. Arm® Debug Interface V5 Architecture Specification (see documentation at Arm.com)

Trademarks

SimpleLink™ and SmartRF™ are trademarks of Texas Instruments.

CoreSight™ is a trademark of Arm Limited (or its subsidiaries) in the US and/or elsewhere.

Motorola™ is a trademark of Motorola, Inc..

Arm®, and Cortex®, and Thumb® are registered trademarks of Arm Limited (or its subsidiaries) in the US and/or elsewhere.

Bluetooth® is a registered trademark of Bluetooth SIG, Inc..

Zigbee® is a registered trademark of Zigbee Alliance.

All trademarks are the property of their respective owners.

1 Architectural Overview

The CC23xx SimpleLink™ ultra-low-power wireless MCUs provide solutions for a wide range of applications. To help the user develop these applications, this user's guide focuses on the use of the different building blocks of the devices. For detailed device descriptions, complete feature lists, and performance numbers, see the data sheet for the specific device. The following subsections provide easy access to relevant information and guide the reader to the different chapters in this document.

The CC23xx SimpleLink ultra-low-power wireless MCUs are optimized for ultra-low power while providing fast and capable MCU systems to enable short processing times and high integration. The combination of an Arm® Cortex®-M0+ processing core at 48MHz, flash memory, and a wide selection of peripherals makes the CC23xx specifically designed for single-chip implementation or network processor implementations of lower-power RF nodes.

1.1 Target Applications

The device is positioned for low-power wireless applications, such as:

  • Consumer electronics
  • Mobile phone accessories
  • Sports and fitness equipment
  • HID applications
  • Home and building automation
  • Grid infrastructure
    • Solar inverter
    • E-meter
  • Lighting control
  • Alarm and security
  • Electronic shelf labeling
  • Proximity tags
  • Medical electronics
    • Glucose monitor
    • Heart rate sensor
  • Remote controls
  • Smart metering
  • Asset tracking
  • Wireless sensor networks
  • Car access and security systems
    • Passive entry passive start (PEPS)
    • Remote keyless entry (RKE)
  • Advanced driver assistance systems (ADAS)
  • Tire pressure monitoring systems (TPMS)

1.2 Introduction

Figure 1-1 shows the building blocks of the CC23xx platform. The following sections provide an overview of the features of the CC23xx.

CC23xx CC23xx Block DiagramFigure 1-1 CC23xx Block Diagram

CC23xx devices have the following features:

  • Arm® Cortex® M0+ processor core
    • Arm Cortex SysTick timer
    • Nested Vectored Interrupt Controller (NVIC)
  • Clocks
    • 48MHz RC oscillator and 48MHz crystal oscillator
    • 32kHz crystal oscillator and 32kHz RC oscillator
  • On-chip memory
    • Up to 512KB of in-system programmable flash
    • Up to 36KB of ultra-low leakage SRAM. Retained in standby mode
  • Power Management
    • Wide supply voltage range
    • Efficient on-chip DC/DC converter for reduced power consumption
    • Flexible low-power modes allowing low energy consumption in duty-cycled applications
  • Advanced Serial Integration
    • Universal asynchronous receiver-transmitter (UART)
    • Inter-Integrated Circuit (I2C)
    • Serial peripheral interface (SPI)
  • System Integration
    • Direct memory access controller (µDMA)
    • Up to four general-purpose timers capable of pulse width modulation (PWM), synchronization, capture, counting, and quadrature decoding
    • 32kHz real-time clock (RTC)
    • Watchdog timer
    • System Timer (SYSTIM) with the same time base as RTC but up to 250ns resolution
    • Battery Monitor: On-chip temperature and supply voltage sensing
    • GPIO with normal or high-drive capabilities
    • GPIO with analog capability for ADC and comparator
    • Configurable pin multiplexing
    • Low power comparator
    • 12-bit ADC, 1.2Mbps with external reference, 260kbps with internal reference, up to eight external ADC inputs
    • Thermal shutdown module
    • Security enablers
      • AES 128-bit cryptographic accelerator
      • Random number generator from on-chip analog noise
  • Arm SWD debug interface
  • 2.4GHz RF transceiver compatible with Bluetooth® 5.3 Low Energy and IEEE 802.15.4 PHY and MAC
  • Integrated Balun
  • Output power up to +8dBm with temperature compensation
  • Wireless protocol support:
    • Bluetooth 5.3 Low Energy
    • Zigbee®
    • SimpleLink™ TI 15.4 stack
    • Proprietary Systems
  • For packaging options see the device-specific data sheet

For applications requiring extreme conservation of power, the CC23xx device features a power-management system to efficiently power down the device to a low-power state during extended periods of inactivity. A power-up and power-down sequencer, a 32-bit sleep timer (an RTC) with interrupt capabilities, and ultra-low-leakage (ULL) RAM with retention in all power modes position the MCU for battery applications. The CC23xx device platform offers the advantages of the widely available development tools of Arm, SoC infrastructure IP applications, and a large user community. Additionally, the microcontroller uses Arm Thumb®-compatible Thumb-2 instruction set to reduce memory requirements.

TI offers a complete support package to assist in getting to market quickly, with evaluation and development boards, white papers and application notes, an easy-to-use peripheral driver library, a software development kit (SDK) with qualified wireless protocols, and a strong support, sales, and distributor network.

1.3 Arm Cortex M0+

The following subsections provide an overview of the Arm Cortex M0+, the integrated system timer (SysTick), and the NVIC.

1.3.1 Processor Core

The CC23xx device is designed around an Arm Cortex M0+ processor core. The Arm Cortex M0+ processor is the core for a high-performance, low-cost platform that meets the needs of minimal memory implementation, reduced pin count, and low power consumption.

Features of the processor core are as follows:

  • The Thumb instruction set combines high code density with 32-bit performance
  • Integrated sleep modes for low power consumption
  • Hardware multiplier
  • Deterministic interrupt handling for time-critical applications
  • Serial Wire Debug reduces the number of pins required for debugging.

1.3.2 SysTick Timer

The Arm Cortex M0+ processor includes an integrated Sytick Timer. SysTick provides a simple, 24-bit, clear-on-write, decrementing, wrap-on-zero counter with a flexible control mechanism. The counter can be used in several different ways, for example:
  • A variable rate alarm or signal timer—the duration is range-dependent on the reference clock used and the dynamic range of the counter
  • A simple counter used to measure time to completion and time used
  • An internal clock-source control based on missing or meeting durations

1.3.3 Nested Vectored Interrupt Controller

The CC23xx device controller includes the Arm NVIC. The NVIC and Arm Cortex M0+ prioritize and handle all exceptions in handler mode. The processor state is automatically stored to the stack on an exception and automatically restored from the stack at the end of the interrupt service routine (ISR). The processor supports tail-chaining, that is, back-to-back interrupts can be performed without the overhead of state saving and restoration. The software can set priority/preemption grouping in eight levels on internal CPU exceptions and interrupts.

Features of the NVIC include:

  • Deterministic, fast interrupt processing
  • External non-maskable interrupt (NMI) signal available for immediate execution of NMI handler
  • Dynamically reprioritizable interrupts
  • Exceptional interrupt handling through hardware implementation of required register manipulations

1.3.4 System Control Block (SCB)

The system control block (SCB) provides system implementation information and system control (configuration, control, and reporting of system exceptions).

1.4 On-Chip Memory

The following subsections describe the on-chip memory modules.

 
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