CC2340R5-Q1 SimpleLink™ Wireless MCU Device Revision B
Abstract
This document describes the known exceptions to functional specifications (advisories) to the CC2340R5-Q1SimpleLink™ device.
Trademarks
SimpleLink™ and Texas Instruments™ are trademarks of Texas Instruments.
All trademarks are the property of their respective owners.
1 Advisories Matrix
Table 1-1 lists all advisories, modules affected, and the applicable silicon revisions.
| MODULE | DESCRIPTION | SILICON REVISIONS AFFECTED | |||
|---|---|---|---|---|---|
| B | |||||
| SPI | Advisory SPI_04—Hang scenario with SPI waiting for CPU intervention forever | Yes | |||
| ADC | Advisory ADC_08—ADC BUSY bit not cleared in repeat single, sequence and repeat sequence conversion modes. | Yes | |||
| ADC | Advisory ADC_09—ADC can have random conversion errors. | Yes | |||
| BATMON | Advisory BATMON_01—Incorrect temperature measurement | Yes | |||
| CKM | Advisory CLK_01—Bluetooth Low Energy link may not be maintained when using LFOSC only | Yes | |||
| I2C | Advisory I2C_02—SDA and SCL open-drain output buffer issue | Yes | |||
| GPIO | Advisory GPIO_01—Open-drain configuration can drive a short high pulse | Yes | |||
2 Nomenclature, Package Symbolization, and Revision Identification
2.1 Device and Development Support-Tool Nomenclature
To designate the stages in the product development cycle, Texas Instruments™ assigns prefixes to the part numbers of all devices and support tools. Each device has one of three prefixes: X, P, or null (for example, XCC2340R5-Q1). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (X/TMDX) through fully qualified production devices/tools (null/TMDS).
Device development evolutionary flow:
- XExperimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow.
- PPrototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications.
- nullProduction version of the silicon die that is fully qualified.
Support tool development evolutionary flow:
- TMDXDevelopment-support product that has not yet completed Texas Instruments internal qualification testing.
- TMDSFully-qualified development-support product.
X and P devices and TMDX development-support tools are shipped against the following disclaimer:
"Developmental product is intended for internal evaluation purposes."
Production devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate is still undefined. Only qualified production devices are to be used.
2.2 Devices Supported
This document supports the following device:
2.3 Package Symbolization and Revision Identification
Figure 2-1 and Table 2-1 describe package symbolization and the device revision code.
Figure 2-1 Package Symbolization| Device Revision Code | Silicon Revision |
|---|---|
| B | PG2.0 |
3 Advisories
3.1 SPI_04
Hang scenario with SPI waiting for CPU intervention forever.
Revisions Affected
BDetails
When the CPU is reading or writing the SPI FIFO using FIFO level triggers to generate interrupts, the system can hang. After the first interrupt is serviced, the FIFO level can permanently be below or above the configured threshold and not generate a subsequent CPU interrupt. This can lead to a hang scenario with SPI waiting for CPU intervention forever.Workaround
- Use polling of FIFO status within SPI and do not rely on FIFO level configured interrupts, or
- Use only empty/overflow interrupts and don't use FIFO level configured interrupts, or
- Use FIFO level configured interrupts along with empty (for TXFIFO) and overflow (for RXFIFO) as a failsafe to avoid hang scenarios.
