Refer to the PDF data sheet for device specific package drawings
This 30-V, 54-mΩ, N-Channel FemtoFET™ MOSFET technology is designed and optimized to minimize the footprint in many handheld and mobile applications. This technology is capable of replacing standard small signal MOSFETs while providing at least a 60% reduction in footprint size.
TA = 25°C | TYPICAL VALUE | UNIT | ||
---|---|---|---|---|
VDS | Drain-to-Source Voltage | 30 | V | |
Qg | Gate Charge Total (4.5 V) | 2.1 | nC | |
Qgd | Gate Charge Gate-to-Drain | 0.63 | nC | |
RDS(on) | Drain-to-Source On-Resistance | VGS = 1.8 V | 110 | mΩ |
VGS = 2.5 V | 67 | mΩ | ||
VGS = 4.5 V | 56 | mΩ | ||
VGS = 8.0 V | 54 | mΩ | ||
VGS(th) | Threshold Voltage | 0.9 | V |
DEVICE(1) | QTY | MEDIA | PACKAGE | SHIP |
---|---|---|---|---|
CSD17382F4 | 3000 | 7-Inch Reel | Femto (0402) 1.0-mm × 0.6-mm SMD Lead Less | Tape and Reel |
CSD17382F4T | 250 |
TA = 25°C | VALUE | UNIT | |
---|---|---|---|
VDS | Drain-to-Source Voltage | 30 | V |
VGS | Gate-to-Source Voltage | 10 | V |
ID | Continuous Drain Current(1) | 2.3 | A |
IDM | Pulsed Drain Current(2) | 14.8 | A |
PD | Power Dissipation(1) | 500 | mW |
ESD Rating | Human Body Model (HBM) | 3000 | V |
Charged Device Model (CDM) | 2000 | V | |
TJ, Tstg | Operating Junction, Storage Temperature | –55 to 150 | °C |
EAS | Avalanche Energy, Single Pulse ID = 6.5 A, L = 0.1 mH, RG = 25 Ω | 2.1 | mJ |