Refer to the PDF data sheet for device specific package drawings
This 60-V, 8.1-mΩ, SON 3.3-mm × 3.3-mm NexFET™ power MOSFET is designed to minimize losses in power conversion applications.
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TA = 25°C | TYPICAL VALUE | UNIT | ||
---|---|---|---|---|
VDS | Drain-to-Source Voltage | 60 | V | |
Qg | Gate Charge Total (10 V) | 11.1 | nC | |
Qgd | Gate Charge Gate-to-Drain | 1.7 | nC | |
RDS(on) | Drain-to-Source On Resistance | VGS = 4.5 V | 12.0 | mΩ |
VGS = 10 V | 8.1 | |||
VGS(th) | Threshold Voltage | 2.0 | V |
DEVICE | MEDIA | QTY | PACKAGE | SHIP |
---|---|---|---|---|
CSD18543Q3A | 13-Inch Reel | 2500 | SON 3.30-mm × 3.30-mm Plastic Package |
Tape and Reel |
CSD18543Q3AT | 7-Inch Reel | 250 |
TA = 25°C | VALUE | UNIT | |
---|---|---|---|
VDS | Drain-to-Source Voltage | 60 | V |
VGS | Gate-to-Source Voltage | ±20 | V |
ID | Continuous Drain Current (Package Limited) | 35 | A |
Continuous Drain Current (Silicon Limited), TC = 25°C | 60 | ||
Continuous Drain Current(1) | 12 | ||
IDM | Pulsed Drain Current(2) | 156 | A |
PD | Power Dissipation(1) | 2.8 | W |
Power Dissipation, TC = 25°C | 66 | ||
TJ, Tstg |
Operating Junction, Storage Temperature |
–55 to 150 | °C |
EAS | Avalanche Energy, Single Pulse ID = 33 A, L = 0.1 mH, RG = 25 Ω |
55 | mJ |
RDS(on) vs VGS![]() |
Gate Charge![]() |
DATE | REVISION | NOTES |
---|---|---|
December 2016 | * | Initial release. |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | ||
---|---|---|---|---|---|---|---|
STATIC CHARACTERISTICS | |||||||
BVDSS | Drain-to-source voltage | VGS = 0 V, ID = 250 μA | 60 | V | |||
IDSS | Drain-to-source leakage current | VGS = 0 V, VDS = 48 V | 1 | μA | |||
IGSS | Gate-to-source leakage current | VDS = 0 V, VGS = 20 V | 100 | nA | |||
VGS(th) | Gate-to-source threshold voltage | VDS = VGS, ID = 250 μA | 1.5 | 2.0 | 2.7 | V | |
RDS(on) | Drain-to-source on resistance |
VGS = 4.5 V, ID = 12 A | 12.0 | 15.6 | mΩ | ||
VGS = 10 V, ID = 12 A | 8.1 | 9.9 | mΩ | ||||
gfs | Transconductance | VDS = 6 V, ID = 12 A | 40 | S | |||
DYNAMIC CHARACTERISTICS | |||||||
Ciss | Input capacitance | VGS = 0 V, VDS = 30 V, ƒ = 1 MHz | 885 | 1150 | pF | ||
Coss | Output capacitance | 168 | 218 | pF | |||
Crss | Reverse transfer capacitance | 4.8 | 6.2 | pF | |||
RG | Series gate resistance | 0.5 | 1.0 | Ω | |||
Qg | Gate charge total (4.5 V) | VDS = 30 V, ID = 12 A | 5.6 | 7.3 | nC | ||
Qg | Gate charge total (10 V) | 11.1 | 14.5 | ||||
Qgd | Gate charge gate-to-drain | 1.7 | nC | ||||
Qgs | Gate charge gate-to-source | 3.1 | nC | ||||
Qg(th) | Gate charge at Vth | 2.0 | nC | ||||
Qoss | Output charge | VDS = 30 V, VGS = 0 V | 24 | nC | |||
td(on) | Turnon delay time | VDS = 30 V, VGS = 10 V, IDS = 12 A, RG = 0 Ω |
9 | ns | |||
tr | Rise time | 18 | ns | ||||
td(off) | Turnoff delay time | 8 | ns | ||||
tf | Fall time | 4 | ns | ||||
DIODE CHARACTERISTICS | |||||||
VSD | Diode forward voltage | ISD = 12 A, VGS = 0 V | 0.8 | 1.0 | V | ||
Qrr | Reverse recovery charge | VDS= 30 V, IF = 12 A, di/dt = 300 A/μs |
37 | nC | |||
trr | Reverse recovery time | 27 | ns |
THERMAL METRIC | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|
RθJC | Junction-to-case thermal resistance(1) | 1.9 | °C/W | ||
RθJA | Junction-to-ambient thermal resistance(1)(2) | 55 |
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Max RθJA = 55°C/W when mounted on 1 in2 (6.45 cm2) of 2-oz (0.071-mm) thick Cu. |
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Max RθJA = 160°C/W when mounted on a minimum pad area of 2-oz (0.071-mm) thick Cu. |
ID = 12 A | VDS = 30 V | ||
ID = 250 µA | ||
ID = 12 A | ||
Single pulse, max RθJC = 1.9°C/W | ||||
Max RθJC = 1.9°C/W | ||
VDS = 5 V | ||