SLAS767B June   2011  – March 2015 DAC7551-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital-to-Analog Converter
      2. 7.3.2 Resistor String
      3. 7.3.3 Output Buffer Amplifiers
        1. 7.3.3.1 DAC External Reference Input
        2. 7.3.3.2 Amplifier Sense Input
        3. 7.3.3.3 Power-On Reset
        4. 7.3.3.4 Power Down
        5. 7.3.3.5 Asynchronous Clear
        6. 7.3.3.6 IOVDD and Level Shifters
      4. 7.3.4 Integral and Differential Linearity
      5. 7.3.5 Glitch Energy
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
        1. 7.5.1.1 16-Bit Word and Input Shift Register
        2. 7.5.1.2 Daisy-Chain Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Waveform Generation
      2. 8.1.2 Generating ±5-V, ±10-V, and ±12-V Outputs For Precision Industrial Control
        1. 8.1.2.1 Loop Accuracy
        2. 8.1.2.2 Loop Speed
    2. 8.2 Typical Application
      1. 8.2.1 Generating Industrial Voltage Ranges
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Qualified for Automotive Applications
  • Relative Accuracy (INL): ±0.35 LSB
  • Ultra-Low Glitch Energy: 0.1 nV-s
  • Low-Power Operation: 100 μA at 2.7 V
  • Power-On Reset-to-Zero Scale
  • Power Supply: 2.7- to 5.5-V Single Supply
  • Power-Down: 0.05 μA at 2.7 V
  • 12-Bit Linearity and Monotonicity
  • Rail-to-Rail Voltage Output
  • Settling Time: 5 μs (Max)
  • SPI-Compatible Serial Interface With Schmitt-Trigger Input: Up to 50 MHz
  • Daisy-Chain Capability
  • Asynchronous Hardware Clear-to-Zero Scale
  • Specified Temperature Range:
    –40°C to +105°C
  • Small, 2-mm × 3-mm, 12-Lead USON Package
  • Z-Suffix Offers Improved Delamination

2 Applications

  • Portable, Battery-Powered Instruments
  • Digital Gain and Offset Adjustment
  • Programmable Voltage and Current Sources
  • Programmable Attenuators
  • Industrial Process Control
  • ADAS Radar Applications
  • Collision Warning
  • Blind-Spot Detection

3 Description

The DAC7551-Q1 device is a single-channel, voltage-output digital-to-analog converter (DAC) with exceptional linearity and monotonicity, and a proprietary architecture that minimizes glitch energy. The low-power DAC7551-Q1 device operates from a single 2.7- to 5.5-V supply. The DAC7551-Q1 output amplifiers can drive a 2-kΩ, 200-pF load rail-to-rail with 5-μs settling time. The output range is set using an external voltage reference.

The 3-wire serial interface operates at clock rates up to 50 MHz and is compatible with SPI™, QSPI™, microwire, and DSP interface standards. The device incorporates a power-on-reset (POR) circuit to ensure that the DAC output powers up to 0 V and remains at that voltage until a valid write cycle to the device occurs. The device contains a power-down feature that reduces the current consumption of the device to under 2 μA.

Small size and low-power operation make the DAC7551-Q1 device ideally suited for battery-operated, portable applications. The power consumption is typically 0.5 mW at 5 V, 0.23 mW at
3 V, and reduces to 1 μW in power-down mode.

The DAC7551-Q1 device is available in a 12-pin USON package and is specified over –40°C to +105°C. The Z-suffix offers reduced delamination compared to standard device.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
DAC7551-Q1 USON (12) 2.00 mm × 3.00 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

Functional Block Diagram

DAC7551-Q1 fbd_las441.gif