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  • DLP4500 .45 WXGA DMD

    • DLPS151B January   2019  – May 2022 DLP4500

      PRODUCTION DATA  

  • CONTENTS
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  • DLP4500 .45 WXGA DMD
  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Chipset Component Usage Specification
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  Storage Conditions
    3. 7.3  ESD Ratings
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Thermal Information
    6. 7.6  Electrical Characteristics
    7. 7.7  Timing Requirements
    8. 7.8  System Mounting Interface Loads
    9. 7.9  Micromirror Array Physical Characteristics
    10. 7.10 Micromirror Array Optical Characteristics
    11. 7.11 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operating Modes
    5. 8.5 Micromirror Array Temperature Calculation
      1. 8.5.1 Package Thermal Resistance
      2. 8.5.2 Case Temperature
        1. 8.5.2.1 Temperature Calculation
    6. 8.6 Micromirror Landed-on/Landed-Off Duty Cycle
      1. 8.6.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 8.6.2 Landed Duty Cycle and Useful Life of the DMD
      3. 8.6.3 Landed Duty Cycle and Operational DMD Temperature
      4. 8.6.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 DLPC350 System Interfaces
          1. 9.2.2.1.1 Control Interface
          2. 9.2.2.1.2 Input Data Interface
        2. 9.2.2.2 DLPC350 System Output Interfaces
          1. 9.2.2.2.1 Illumination Interface
          2. 9.2.2.2.2 Trigger Interface (Sync Outputs)
        3. 9.2.2.3 DLPC350 System Support Interfaces
          1. 9.2.2.3.1 Reference Clock
          2. 9.2.2.3.2 PLL
          3. 9.2.2.3.3 Program Memory Flash Interface
        4. 9.2.2.4 DMD Interfaces
          1. 9.2.2.4.1 DLPC350 to DMD Digital Data
          2. 9.2.2.4.2 DLPC350 to DMD Control Interface
          3. 9.2.2.4.3 DLPC350 to DMD Micromirror Reset Control Interface
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Sequencing Requirements
    2. 10.2 DMD Power Supply Power-Up Procedure
    3. 10.3 DMD Power Supply Power-Down Procedure
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 DMD Interface Design Considerations
      2. 11.1.2 DMD Termination Requirements
      3. 11.1.3 Decoupling Capacitors
      4. 11.1.4 Power Plane Recommendations
      5. 11.1.5 Signal Layer Recommendations
      6. 11.1.6 General Handling Guidelines for CMOS-Type Pins
      7. 11.1.7 PCB Manufacturing
        1. 11.1.7.1 General Guidelines
        2. 11.1.7.2 Trace Widths and Minimum Spacings
        3. 11.1.7.3 Routing Constraints
        4. 11.1.7.4 Fiducials
        5. 11.1.7.5 Flex Considerations
        6. 11.1.7.6 DLPC350 Thermal Considerations
    2. 11.2 Layout Example
      1. 11.2.1 Printed Circuit Board Layer Stackup Geometry
      2. 11.2.2 Recommended DLPC350 MOSC Crystal Oscillator Configuration
      3. 11.2.3 Recommended DLPC350 PLL Layout Configuration
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Device Nomenclature
    2. 12.2 Device Markings
    3. 12.3 Documentation Support
      1. 12.3.1 Related Documentation
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Support Resources
    6.     Trademarks
    7. 12.6 Electrostatic Discharge Caution
    8. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
  14. IMPORTANT NOTICE

Package Options

Mechanical Data (Package|Pins)
  • FQE|80
    • MPLG046B
  • FQD|98
    • MCLG010B
Thermal pad, mechanical data (Package|Pins)
Orderable Information
  • dlps151b_oa
search No matches found.
  • Full reading width
    • Full reading width
    • Comfortable reading width
    • Expanded reading width
  • Card for each section
  • Card with all content

 

DATA SHEET

DLP4500 .45 WXGA DMD

1 Features

  • 0.45-Inch Diagonal Micromirror Array
    • 912 × 1140 Resolution Array (>1 Million Micromirrors)
    • Diamond Array Orientation Supports Side Illumination for Simplified, Efficient Optics Designs
    • Capable of WXGA Resolution Display
    • 7.6-µm Micromirror Pitch
    • ±12° Tilt Angle
    • 5-µs Micromirror Crossover Time
  • Highly Efficient Steering of Visible Light
    • Window Transmission Efficiency 96% Nominal (420 to 700 nm, Single Pass Through Two Window Surfaces)
    • Polarization-Independent Aluminum Micromirrors
    • Array Fill Factor 92% (Nominal)
  • Dedicated DLPC350 Controller for Reliable Operation
    • Binary Pattern Rates Up to 4 kHz
    • Pattern Sequence Mode for Control Over Each Micromirror in Array
  • Integrated Micromirror Driver Circuitry
  • 9.1-mm × 20.7-mm for Portable Instruments
    • FQE Package With Simple Connector Interface
    • FQD Package With Enhanced Thermal Interface
    ™

2 Applications

  • Machine Vision
    • 3-D Depth Measurement
    • Robotic Guidance
    • Inline Surface Inspection
    • Pick and Place
    • 3-D Capture
    • Defect Rejection
  • Medical Instruments
    • 3-D Dental Scanners
    • Vascular Imaging
  • 3-D Biometrics
    • Fingerprint Identification
    • Facial Recognition
  • Virtual Gauges
  • Augmented Reality
  • Interactive Display
  • Microscopes

3 Description

The DLP4500 digital micromirror device (DMD) acts as a spatial light modulator (SLM) to steer visible light and create patterns with speed, precision, and efficiency. Featuring high resolution and high brightness in a compact form factor, the DLP4500 DMD is well-suited for very accurate, portable 3D machine vision and display solutions used in industrial, medical, and security applications.
PART NUMBER PACKAGE(1) THERMAL INTERFACE AREA
DLP4500 LCCC (80) (2) None
LCCC (98) (3) 7 mm x 7 mm
(1) For all available packages, see the orderable addendum at the end of the data sheet.
(2) FQE package (Series-241) drawing. See DLP® Series-241 DMD and System Mounting Concepts for more information.
(3) FQD package (Series-310) drawing. See DLP® Series-310 DMD and System Mounting Concepts for more information.
GUID-3D01D0AE-32CC-4855-AC54-48C445309D75-low.gif Figure 3-1 Simplified Application

4 Revision History

Changes from Revision A (October 2021) to Revision B (May 2022)

  • Updated Absolute Maximum Ratings disclosure to the latest TI standardGo
  • Updated Micromirror Array Optical Characteristics Go
  • Added Third-Party Products Disclaimer Go

Changes from Revision * (January 2019) to Revision A (October 2021)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Updated |TDELTA| MAX from 30°C to 15°CGo

5 Chipset Component Usage Specification

Note:

TI assumes no responsibility for image quality artifacts or DMD failures caused by optical system operating conditions exceeding limits described previously.

The DLP4500 is a component of one or more ®DLP chipsets. Reliable function and operation of the DLP4500 requires that it be used in conjunction with the other components of the applicable DLP chipset, including those components that contain or implement TI DMD control technology. TI DMD control technology is the TI technology and devices for operating or controlling a DLP DMD.

 
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