DLPS013G
April 2010 – January 2019
DLP5500
PRODUCTION DATA.
1
Features
2
Applications
3
Description
Device Images
Typical Application Schematic
4
Revision History
5
Description (continued)
6
Pin Configuration and Functions
Pin Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
Storage Conditions
7.3
ESD Ratings
7.4
Recommended Operating Conditions
7.5
Thermal Information
7.6
Electrical Characteristics
7.7
Timing Requirements
7.8
System Mounting Interface Loads
7.9
Micromirror Array Physical Characteristics
7.10
Micromirror Array Optical Characteristics
7.11
Window Characteristics
7.12
Chipset Component Usage Specification
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.4
Device Functional Modes
8.4.1
Video Modes
8.4.2
Structured Light Modes
8.4.2.1
Static Image Buffer Mode
8.4.2.2
Real Time Structured Light Mode
8.5
Window Characteristics and Optics
8.5.1
Optical Interface and System Image Quality
8.5.2
Numerical Aperture and Stray Light Control
8.5.3
Pupil Match
8.5.4
Illumination Overfill
8.6
Micromirror Array Temperature Calculation
8.6.1
Package Thermal Resistance
8.6.2
Case Temperature
8.6.3
Micromirror Array Temperature Calculation for Uniform Illumination
8.7
Micromirror Landed-on/Landed-Off Duty Cycle
8.7.1
Definition of Micromirror Landed-On/Landed-Off Duty Cycle
8.7.2
Landed Duty Cycle and Useful Life of the DMD
8.7.3
Landed Duty Cycle and Operational DMD Temperature
8.7.4
Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.2.1
DLP5500 System Interface
10
Power Supply Recommendations
10.1
DMD Power-Up and Power-Down Procedures
11
Layout
11.1
Layout Guidelines
11.1.1
Impedance Requirements
11.1.2
PCB Signal Routing
11.1.3
Fiducials
11.2
Layout Example
12
Device and Documentation Support
12.1
Device Support
12.1.1
Device Nomenclature
12.2
Documentation Support
12.2.1
Related Documentation
12.3
Related Documentation
12.4
Community Resources
12.5
Trademarks
12.6
Electrostatic Discharge Caution
12.7
Glossary
13
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
FYA|149
MCLG018B
Thermal pad, mechanical data (Package|Pins)
Orderable Information
dlps013g_oa
dlps013g_pm
1
Features
0.55-Inch Micromirror Array Diagonal
1024 × 768 Array of Aluminum, Micrometer-Sized Mirrors (XGA Resolution)
10.8-µm Micromirror Pitch
±12° Micromirror Tilt Angle
(Relative to Flat State)
Designed for Corner Illumination
Designed for Use With Broadband Visible Light (420 nm – 700 nm):
Window Transmission 97% (Single Pass, Through Two Window Surfaces)
Micromirror Reflectivity 88%
Array Diffraction Efficiency 86%
Array Fill Factor 92%
16-Bit, Low Voltage Differential Signaling (LVDS) Double Data Rate (DDR) Input Data Bus
200 MHz Input Data Clock Rate
Dedicated DLPC200 Controller for High-Speed Pattern Rates:
5,000 Hz (1-Bit Binary Patterns)
500 Hz (8-Bit Grayscale Patterns)
Series 450 Package Characteristics:
Thermal Area 18 mm × 12 mm Enabling High on Screen Lumens (>2000 lm)
149 Micro Pin Grid Array Robust Electrical Connection
Package Mates to Amphenol InterCon Systems 450-2.700-L-13.25-149 Socket