The DS125DF111 is a dual channel (1-lane bidirectional) retimer with integrated signal conditioning. The DS125DF111 includes an input Continuous-Time Linear Equalizer (CTLE), clock and data recovery (CDR) and transmit driver on each channel.
The DS125DF111 with its on-chip Decision Feedback Equalizer (DFE) can enhance the reach and robustness of long, lossy, cross-talk-impaired high speed serial links to achieve BER < 1x10–15. For less demanding applications/interconnects, the DFE can be switched off and achieve the same BER performance. The DS125DF111 and DS110DF111 devices are pin-compatible.
Each channel of the DS125DF111 independently locks to specific serial data at data rates from 9.8 to 12.5 Gbps or to any supported sub-rate of these data rates. This simplifies system design and lowers overall cost.
Programmable transmit de-emphasis driver offers precise settings to meet the SFF-8431 output eye template. The fully adaptive receive equalization (CTLE and DFE) enables longer distance transmission in lossy copper interconnect and backplanes with multiple connectors. The CDR function is ideal for use in front port parallel optical module applications to reset the jitter budget and retime high speed serial data.
PART NUMBER | PACKAGE | BODY SIZE (NOM) |
---|---|---|
DS125DF111 | WQFN (24) | 4.0 mm × 4.0 mm |
Changes from * Revision (January 2014) to A Revision
PIN | I/O TYPE | DESCRIPTION | |
---|---|---|---|
NAME | NO. | ||
HIGH SPEED DIFFERENTIAL I/OS | |||
OUTA± | 7, 8 | O, CML | Inverting and non-inverting CML-compatible differential outputs. Outputs require AC coupling |
OUTB± | 20, 19 | O, CML | Inverting and non-inverting CML-compatible differential outputs. Outputs require AC coupling |
INA± | 24, 23 | I, CML | Inverting and non-inverting CML-compatible differential inputs. An on-chip 100 Ω terminating resistor connects INA+ to INA- Inputs require AC coupling. TI recommends 100 nF capacitors. Note that for SFP+ applications, AC coupling is included as part of the SFP+ module. |
INB± | 11, 12 | I, CML | Inverting and non-inverting CML-compatible differential inputs. An on-chip 100 Ω terminating resistor connects INB+ to INB- Inputs require AC coupling. TI recommends 100 nF capacitors. Note that for SFP+ applications, AC coupling is included as part of the SFP+ module. |
LOOP FILTER CONNECTION PIN | |||
LPF_CP_A, LPF_REF_A | 2, 1 | I/O, analog | Loop filter connection, place a 22 nF ± 10% capacitor in series between LPF_CP_A and LPF_REF_A |
LPF_CP_B, LPF_REF_B | 17, 18 | I/O, analog | Loop filter connection, place a 22 nF ± 10% capacitor in series between LPF_CP_B and LPF_REF_B |
REFERENCE CLOCK I/O | |||
REFCLK_IN | 14 | I, LVCMOS | 25 MHz ± 100 ppm clock from external Oscillator |
INDICATOR PINS | |||
LOCK | 16 | O, LVCMOS | LOCK VOH is referenced to VIN voltage level. Note that this pin is shared with strap input functions read at startup. The Address value loaded into pin 16 (ADDR0) at startup changes the definition of the LOCK pin output. See the Shared Register Definition in Table 7 for more details. |
LOS/INT# | 13 | O, Open Drain | Output is driven LOW when a valid signal is present on INA. Output is released when signal on INA is lost (LOS). This output can be redefined as an INT# signal which will be driven LOW for any of the following conditions.(2)
1. The EOM check returns a value below the HEO/VEO interrupt threshold. 2. CDR check returns lock/loss status. 3. Signal Detector returns detect/loss status. |
SMBus MODE PINS | |||
ENSMB | 3 | I, 4-Level | System Management Bus (SMBus) enable pin HIGH = Register Access, SMBus Slave mode FLOAT = SMBus Master read from External EEPROM 20 K to GND = Reserved LOW = External Pin Control Mode. See section on Pin Mode Limitation |
SDA | 4 | I, SMBus O, Open Drain |
Data Input / Open Drain Output External pull-up resistor is required. Pin is 3.3 V LVCMOS tolerant(2) |
SCL | 5 | I, SMBus O, Open Drain |
Clock input in SMBus slave mode. Can also be an open drain output in SMBus master mode Pin is 3.3 V LVCMOS Tolerant(2) |
TX_DIS | 6 | I, 4-Level | Disable the OUTB transmitter HIGH = OUTA Enabled/OUTB Disabled FLOAT = Reserved 20 K to GND = Reserved LOW = OUTA/OUTB Enabled (normal operation) |
ADDR0 | 16 | I, LVCMOS | This pin sets the SMBus address for the retimer. This pin is a strap input. The state is read on power-up to set the SMBus address in SMBus control mode. The latched value of ADDR0 read at startup will change the LOCK output definition. See the Shared Register Definition in Table 7 for more details.(3) |
ADDR1/DONE# | 10 | IO, LVCMOS | This pin sets the SMBus address for the retimer in SMBus Slave Mode. DONE#. VOH is referenced to VIN voltage level. DONE# goes low to indicate that the SMBus master EEPROM read has been completed in SMBus Master Mode(3) |
READEN# | 9 | I, LVCMOS | Initiates SMBus master EEPROM read. When multiple DS125DF111 are connected to a single EEPROM, the READEN# input can be daisy chained to the DONE# output. In SMBus Slave Mode this pin should be tied to Logic 0. (4) |
PIN CONTROL (ENSMB = LOW) (1) | |||
DEMA | 4 | I, 4-Level | Set CHA output de-emphasis level in pin control mode (4) |
DEMB | 5 | I, 4-Level | Set CHB output de-emphasis level in pin control mode (4) |
LPBK | 6 | I, 4-Level | HIGH = INA goes to OUTA, INB goes to OUTB FLOAT = INB goes to OUTA and OUTB 20 K to GND = INA goes to OUTA and OUTB LOW = INA goes to OUTB, INB goes to OUTA(4) |
VODA | 9 | I, 4-Level | Set CHA output launch amplitude in pin control mode (4). |
VODB | 10 | I, 4-Level | Set CHB output launch amplitude in pin control mode(4) |
POWER | |||
VDD | 21, 22 | Power | VDD = 2.5 V ± 5%. See Figure 12. 3.3-V supply mode: VDD = 2.5 V is supplied the internal output regulator. Pins only require de-coupling caps; no external supply is needed. 2.5-V supply mode: VDD input = 2.5 V ± 5%. |
VIN | 15 | Power | Regulator Input (4)with Integrated Supply Mode Control. See Figure 12. 3.3-V supply mode: VIN input = 3.3 V ± 10%. 2.5-V Mode Operation: VIN Supply Input = 2.5 V ± 5%. Connect directly to VDD supply pins. |
DAP | PAD | Power | GND reference The exposed pad at the center of the package must be connected to ground plane of the board with at least 4 vias to lower the ground impedance and improve the thermal performance of the package |