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  • HD3SS2522 USB Type-C SS MUX with DFP Controller

    • SLLSEM6B April   2015  – August 2015 HD3SS2522

      PRODUCTION DATA.  

  • CONTENTS
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  • HD3SS2522 USB Type-C SS MUX with DFP Controller
  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Adaptive Common Mode Tracking for USB 3.1 MUX
      2. 7.3.2 DFP-to-UFP Attach/Detach Detection
      3. 7.3.3 Plug Orientation/Cable Twist Detection
      4. 7.3.4 VBUS Fault
      5. 7.3.5 VCONN Fault
    4. 7.4 Device Functional Modes
      1. 7.4.1 Unattached.DFP State
      2. 7.4.2 Attached.DFP State
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 USB Type-C DFP Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 USB Type-C Current Advertising
        2. 8.2.2.2 VCONN and VBUS Power Switch Control
        3. 8.2.2.3 Firmware Upgradability
      3. 8.2.3 USB Type-C DFP Circuit Schematics with a Type C Receptacle
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Critical Routes
      2. 10.1.2 General Routing/Placement Rules
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
  13. IMPORTANT NOTICE

Package Options

Mechanical Data (Package|Pins)
  • RHU|56
    • MPQF178B
Thermal pad, mechanical data (Package|Pins)
Orderable Information
  • sllsem6b_oa
  • sllsem6b_pm
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  • Full reading width
    • Full reading width
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    • Expanded reading width
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DATA SHEET

HD3SS2522 USB Type-C SS MUX with DFP Controller

1 Features

  • Compliant to USB Type-C Specification 1.1
  • Mode Configuration
    • Host Only – DFP
  • Channel Configuration (CC)
    • Attach of USB Port Detection
    • Cable Orientation Detection
    • Type-C Current Mode (Default, Mid, High)
  • Supply Voltage 3.3 V ± 10%
  • 2:1 Mux Solution for USB 3.1 Signaling
  • Operates up to 10 Gbps with Wide -3 dB BW of 8 GHz
  • Excellent Dynamic Characteristics at 2.5 GHz
    • Crosstalk = –39 dB
    • Off Isolation = –22 dB
    • Insertion Loss = –1.2 dB
    • Input Return Loss = –12 dB
  • Low Active (2 mW) and Standby Power (50 μW) Consumption

2 Applications

  • Desktop and Notebook PCs
  • USB Type-C DFP Applications
  • Motherboards

3 Description

HD3SS2522 is a 2:1 USB mux with Configuration Channel (CC) logic with Downstream Facing Port (DFP) support. The HD3SS2522 presents itself as a DFP according to the USB Type-C Spec. The CC logic block monitors the CC1 and CC2 pins voltages to determine when a USB port has been attached. Once a USB port has been attached, the CC logic also determines the orientation of the cable and configures the USB SS mux accordingly.

The HD3SS2522 provides an VBUS_EN signal to control legacy power switch to provide 5 V to VBUS. The device also provides control signals needed to support 5 V VCONN sourcing for ecosystems implementing USB Type-C.

Excellent dynamic characteristics of the device allow high speed switching with minimum attenuation to the signal eye diagram and little added jitter. The device also has low current consumption in Standby mode.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
HD3SS2522 WQFN (56) 11.00 mm x 5.00 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

Simplified Schematic

HD3SS2522 fp_schematic_sllsem6.gif

4 Revision History

Changes from A Revision (July 2015) to B Revision

  • Changed Features From: Compliant to USB Type-C Specification 1.0 To: Compliant to USB Type-C Specification 1.1Go

Changes from * Revision (April 2015) to A Revision

  • Changed the Description of VBUS_EN in the Pin Functions table. Go
  • Changed the Description of VCTRL1 and VCTRL2 in the Pin Functions table. Go

5 Pin Configuration and Functions

RHU Package
Top View
HD3SS2522 po_sllsem6.gif

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
A0p 2 I/O Port A0, High Speed Positive Signal
A0n 3 I/O Port A0, High Speed Negative Signal
A1p 5 I/O Port A1, High Speed Positive Signal
A1n 6 I/O Port A1, High Speed Negative Signal
B0p 48 I/O Port B0, High Speed Positive Signal
B0n 47 I/O Port B0, High Speed Negative Signal
B1p 46 I/O Port B1, High Speed Positive Signal
B1n 45 I/O Port B1, High Speed Negative Signal
C0p 44 I/O Port C0, High Speed Positive Signal
C0n 43 I/O Port C0, High Speed Negative Signal
C1p 42 I/O Port C1, High Speed Positive Signal
C1n 41 I/O Port C1, High Speed Negative Signal
CC_IN 18 I/O Selected CC signal back to the device as input - connect to CC_OUT pin
CC_OUT 11 I/O Selected CC signal as output - connect to CC_IN pin
CC_SEL_IN 12 I CC Signal select pin input – Connect to CC_SEL_OUT
CC_SEL_OUT 19 O CC Signal select pin output – Connect to CC_SEL_IN
CC_OEn_IN 9 I Active Low CC MUX Enable input – connect to CC_OEn_OUT
CC_OEn_OUT /
VconnEnPol		 32 I/O Active Low CC MUX Enable output – connect to CC_OEn. The pin is also sampled upon reset to set the polarity of the VCTRL1 and VCTRL2.
0 = VCTRL1/2 polarity is active high.
1 = VCTRL1/2 polarity is active low.
CC1 37 I/O USB Type-C configuration channel for position 1
CC2 35 I/O USB Type-C configuration channel for position 2
GND 33 , 39, 53 G Ground
GPIO1 28 I/O GPIO or SCL for FW update
GPIO2 29 I/O GPIO or SDA for FW update
IMODE1
IMODE2		 26
27		 I IMODE1 IMODE2 Current Mode
Low Low Default
Low High Mid (1.5 A)
High Low Reserved
High High High (3A)
MODE_LED 15 O High when UFP attach detected
NC 1, 24, 49, 50, 51, 54, 55, 56 Not connected
RST 30 I CC Controller Reset
RSVD 10, 25, 31, 36, 38 I/O Reserved
SS_OEn_IN 8 I Active Low SS MUX Enable input – connect to SS_OEn_OUT
SS_OEn_OUT /
VBUSEnPol		 34 I/O Active Low SS MUX Enable output – connect to SS_OEn_IN. The pin is also sampled upon reset to set the polarity of the VBUS_EN.
0 = VBUS_EN polarity is active high.
1 = VBUS_EN polarity is active low.
SS_SEL_IN 7 I SS Port select pin input – Connect to SS_SEL_OUT
SS_SEL_OUT 20 O SS Port select pin output – Connect to SS_SEL_IN
VBUS_EN 21 O Polarity programmable via VBUSEnPol pin (pin 34). Driven low or high when UFP attach is detected.
VBUS_FAULT# 16 I VBUS Fault signal in from VBUS Power switch. Active low.
VCC 4 , 13, 14, 40, 52 P 3.3V Power
VCONN_FAULT# 17 I VCONN Fault signal in from VCONN switches. Active low.
VCTRL1 22 O Polarity programmable via VconnEnPol pin (pin 32). Driven low or high when active cable is detected.
VCTRL2 23 O Polarity programmable via VconnEnPol pin (pin 32). Driven low or high when active cable is detected.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Power supply voltage range, VCC –0.4 4 V
Voltage Range Differential I/O (High bandwidth signal path, AxP/N, BxP/N, CxP/N) –0.4 2.4
Control Pins and Single Ended I/Os including CC1 and CC2 –0.4 VCC + 0.4
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VCC Supply voltage 3 3.3 3.6 V
VIH Input high voltage Control/Status pins 2 VCC V
VIL Input low voltage Control/Status pins –0.1 0.8 V
VI/O(Diff) Differential voltage Switch I/O diff voltage 0 1.6 VPP
VI/O(CM) Common voltage Switch I/O common mode voltage 0 2 V
VI/O Input / output voltage CC_OUT, CC_IN, and selected CC pin for configuration 0 VCC V
VIN Input voltage Selected CC pin for VCONN 0 5.5 V
TA Operating free-air temperature HD3SS2522RHU 0 70 °C

6.4 Thermal Information

THERMAL METRIC(1) HD3SS2521A UNIT
RHU
56 PINS
RθJA Junction-to-ambient thermal resistance 31.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 15.9
RθJB Junction-to-board thermal resistance 8.5
ψJT Junction-to-top characterization parameter 0.5
ψJB Junction-to-board characterization parameter 8.5
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ICC Supply current VCC = 3.6 V,
SS_OEn, CC_OEn = GND 		0.6 1 mA
I(STANDBY) Standby current VCC = 3.3 V, SS_OEN, CC_OEn = VCC 15 µA
VBUS_FAULT#, VCONN_FAULT#, IMODE1, IMODE2, RST, RSVD, GPIO1, GPIO2
VIT+ Positive-going input threshold voltage 0.45 x VCC 0.75 x VCC V
VIT- Negative-going input threshold voltage 0.25 x VCC 0.55 x VCC V
Vhys nput voltage hysteresis (VIT+ – VIT–) VCC = 3 V 0.3 1 V
RPULL Pullup/pulldown resistor Pullup: VIN = GND,
Pulldown: VIN = VCC, VCC = 3 V 		20 35 50 kΩ
CI Input capacitance VIN = GND or VCC 5 pF
ILGK High-impedance leakage current VIN = GND or VCC, VCC = 3 V,
Pullup/Pulldown disabled		 ±50 nA
VCTRL1, VCTRL2, VBUS_EN
VOL Low-level output voltage IOL(max) = 6 mA (1) GND + 0.3 V
MODE_LED
VOH High-level output voltage IOH(max) = –6 mA (1) VCC – 0.3 V
VOL Low-level output voltage IOL(max) = 6 mA (1) GND + 0.3 V
AxP/N, BxP/N, CxP/N
ILGK High-impedance leakage current VCC = 3.6 V, VIN = 0 V, VOUT = 2 V
(ILKG on open outputs Port B and C) 		130 µA
VCC = 3.6 V, VIN = 0 V, VOUT = 2 V
(ILKG on open outputs Port A) 		4 µA
CC1, CC2
ILGK High-impedance leakage current VCC = 3.6 V, VIN = 0 V,
VOUT = 0 V to 4 V		 1 µA
(1) The maximum total current, IOH(max) and IOL(max), for all outputs combined should not exceed ±48 mA to hold the maximum voltage drop specified.

6.6 Timing Requirements

MIN NOM MAX UNIT
AxP/N, BxP/N, CxP/N HIGH-BANDWIDTH SIGNAL PATH
tPD Switch Propagation Delay RSC and RL = 50 Ω 85 ps
tON SS_SEL_IN -to-Switch tON RSC and RL = 50 Ω 70 250 ns
tOFF SS_SEL_IN -to-Switch tOFF 70 250 ns
HD3SS2522 switch_timing_sllsem6.gifFigure 1. Select to Switch tON and tOFF
HD3SS2522 prop_delay_sllsem6.gif
1. Measurements based on an ideal input with zero intra-pair skew on the input, i.e. the input at A to B/C or the input at B/C to A
2. Inter-pair skew is measured from lane to lane on the same channel, e.g. C0 to C1
3. Intra-pair skew is defined as the relative difference from the p and n signals of a single lane
Figure 2. Propagation Delay and Skew

6.7 Switching Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
AxP/N, BxP/N, CxP/N
tSK(O) Inter-pair output skew
(channel-channel) 		RSC and RL = 50 Ω 20 ps
tSK(b-b) Inter-pair output skew (bit-bit) 8 ps
CON Outputs ON capacitance VIN = 0 V, outputs open, switch ON 1.5 pF
COFF Outputs OFF capacitance VIN = 0 V, outputs open, switch OFF 1 pF
RON Output ON resistance VCC = 3.3 V, VCM = 0.5 V – 1.5 V,
IO = –8 mA 		5 8 Ω
ΔRON On resistance match between channels VCC = 3.3 V; –0.35 V ≤ VIN ≤ 1.2 V;
IO = –8 mA 		2 Ω
On resistance match between pairs of the same channel 0.7
R(FLAT_ON) On resistance flatness
[RON(MAX) – RON(MIN)]		 VCC = 3.3 V; –0.35 V ≤ VIN ≤ 1.2 V 1.15 Ω
RL Differential input return loss
(VCM = 0 V)		 f = 2.5 GHz –12 dB
f = 4 GHz –11
XTALK Differential crosstalk (VCM = 0 V) f = 2.5 GHz –39 dB
f = 4 GHz –35
OIRR Differential off-isolation (VCM = 0 V) f = 2.5 GHz –22 dB
f = 4 GHz –19
IL Differential insertion loss
(VCM = 0 V)		 f = 2.5 GHz –1.1 dB
f = 4 GHz –1.5
BW Bandwidth At 3 dB 6 GHz

 
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